Enhanced skin effect for partial-element equivalent-circuit (PEEC) models
Enhanced skin effect for partial-element equivalent-circuit (PEEC) models
复制标题
增强部分元件等效电路 (PEEC) 模型的集肤效应
DOI：
10.1109/22.868992
复制
发表时间：
2000
影响因子：
4.3
通讯作者：
A. Cangellaris
中科院分区：
文献类型：
--
作者：
K. Coperich;A. Ruehli;A. Cangellaris
本文提出了一种集肤效应建模方法，该方法适用于所有感兴趣的频率范围，因此最适合于瞬态互连分析。然而，新的配方本身的模型，可以抽象为使用与表面积分和基于有限差分的电磁工具互连建模。虽然体积细丝技术在高频率下在计算上是不可行的，其中精细离散化是必要的，但所提出的制剂通过将导体的行为仔细地铸造成全局表面阻抗的形式来避免这种困难，从而需要更少的未知数。几个例子说明了所提出的模型，以准确地捕捉接近和集肤效应的行为的能力将显示，互连电阻和电感每单位长度的结果，并与使用不同的模型获得的结果进行比较。
In this paper, a skin-effect modeling approach is presented that is suitable for all frequency regimes of interest and therefore is most appropriate for transient interconnect analysis. Yet, the new formulation lends itself to a model that can be abstracted for use in conjunction with surface integral and finite difference-based electromagnetic tools for interconnect modeling. While a volume filament technique is not computationally feasible at high frequencies, where a fine discretization is necessary, the formulation that is presented avoids this difficulty by carefully casting the behavior of a conductor into the form of a global surface impedance, thus requiring fewer unknowns. Several examples illustrating the ability of the proposed model to accurately capture proximity and skin-effect behaviors will be shown, Interconnect resistance and inductance per-unit-length results are given and compared with those obtained using different models.