Predictive modeling of surface roughness in grinding
Predictive modeling of surface roughness in grinding
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DOI：
10.1016/s0890-6955(03)00055-5
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发表时间：
2003-06-01
影响因子：
14
通讯作者：
Liang, SY
中科院分区：
文献类型：
--
作者：
Hecker, RL;Liang, SY
表面粗糙度通常用于描述地面表面的质量以及评估整体研磨系统的竞争力。本文介绍了基于概率不明的芯片厚度模型的算术平均表面粗糙度的预测。该模型表示地面饰面是车轮微结构，过程运动条件和材料特性的函数。该分析包括对理想的圆锥晶粒对表面剩余的凹槽进行几何分析。通过芯片厚度模型在表面粗糙度预测中考虑了材料特性和车轮微观结构。发现了将表面粗糙度与芯片厚度相关的简单表达式，使用圆柱形研磨的实验数据进行了验证。 （c）2003 Elsevier Science Ltd.保留所有权利。
The surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. This paper presents the prediction of the arithmetic mean surface roughness based on a probabilistic undeformed chip thickness model. The model expresses the ground finish as a function of the wheel microstructure, the process kinematic conditions, and the material properties. The analysis includes a geometrical analysis of the grooves left on the surface by ideal conic grains. The material properties and the wheel microstructure are considered in the surface roughness prediction through the chip thickness model. A simple expression that relates the surface roughness with the chip thickness was found, which was verified using experimental data from cylindrical grinding. (C) 2003 Elsevier Science Ltd. All rights reserved.