Exploring the correlation between solvent diffusion and creep resistance of Mg-Ga HCP alloys from high throughput liquid-solid diffusion couple
Exploring the correlation between solvent diffusion and creep resistance of Mg-Ga HCP alloys from high throughput liquid-solid diffusion couple
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从高通量液-固扩散偶中探索 Mg-Ga HCP 合金的溶剂扩散与抗蠕变性之间的相关性
DOI:
10.1016/j.matdes.2020.109243
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发表时间:
2021-05
影响因子:
8.4
通讯作者:
Cui Yuwen
中科院分区:
文献类型:
--
作者:
Wang Jingya;Xu Guanglong;Zeng Xiaoqin;Llorca Javier;Cui Yuwen
The liquid-solid diffusion couple technique, supported by phenomenological analysis and nano-indentation tests, is proposed on account of the relatively low melting points of Mg to explore the diffusion mobility and creep deformation. The potential of this strategy is demonstrated in Mgsingle bondGa hcp alloys where Ga solute (i.e. impurity) and Mg solvent diffusions in hcp Mgsingle bondGa alloys were both unveiled. It was followed by mapping the compressive creep behavior via nanoindentation along the composition arrays within the same Mgsingle bondGa couple sample. The compressive creep resistance of Mgsingle bondGa hcp alloys increased with the Ga content, and this enhancement was similar to the one found in Mgsingle bondZn alloys and superior to the one reported in Mgsingle bondAl alloys though Al is a slower impurity diffuser in hcp-Mg than Zn and Ga. Thereby, the solvent diffusion and its variation with the composition, rather than the solute diffusion, was suggested to govern the creep properties at high temperatures and low stresses.
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DOI:
10.1016/s1369-7021(04)00349-9
发表时间:
2016
期刊:
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影响因子:
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作者:
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通讯作者:
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DOI:
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发表时间:
2016
期刊:
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1970-03
期刊:
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通讯作者:
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影响因子:
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通讯作者:
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发表时间:
1984-12
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影响因子:
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作者:
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