Microstructure and electrical property of laser-sintered Cu complex ink
Microstructure and electrical property of laser-sintered Cu complex ink
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DOI：
10.1016/j.apsusc.2014.03.127
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发表时间：
2014-07-15
影响因子：
6.7
通讯作者：
Lee, Myeongkyu
中科院分区：
文献类型：
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作者：
Lee, Jeonghyeon;Lee, Byoungyoon;Lee, Myeongkyu
我们表明，通过激光烧结，可以从铜复合油墨中获得高导电性的铜薄膜。使用甲酸铜作为前体合成的铜油墨被旋涂到聚酰亚胺基板上并用 355 nm 的紫外激光扫描。将N-2气体吹入照射区域可防止薄膜被氧化，并获得1.70×10(-5)SZ·cm的最小电阻率。主要由纳米棒组成的激光烧结薄膜表现出比典型热工艺获得的薄膜更紧密的结构。尽管热烧结铜膜具有更好的结晶质量，但两种方法可获得的最小电阻率值几乎相同。这归因于激光烧结导致的更致密的微观结构。 (c) 2014 年由 Elsevier B.V. 出版
We show that highly conductive Cu films are obtainable from Cu complex ink by laser sintering. The Cu inks, synthesized using Cu formate as a precursor, were spin-coated onto polyimide substrate and scanned by an ultraviolet laser at 355 nm. The blowing of N-2 gas into the irradiated area prevented the film from being oxidized and a minimum resistivity of 1.70 x 10(-5) SZ cm was obtained. The laser-sintered film, composed mainly of nanorods, exhibited a much tighter structure than the one achieved by the typical thermal process. Although the thermal-sintered Cu film had a better crystalline quality, the minimum resistivity values available with both methods were almost identical. This is attributed to the more compact microstructure induced by laser sintering. (c) 2014 Published by Elsevier B.V.