The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate
The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate
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DOI：
10.1016/j.ijsolstr.2023.112160
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发表时间：
2023-02
影响因子：
3.6
通讯作者：
Deng Li;Peijian Chen;Zaixing Huang;Hao Liu;Shaohua Chen
中科院分区：
文献类型：
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作者：
Deng Li;Peijian Chen;Zaixing Huang;Hao Liu;Shaohua Chen
近年来，热电薄膜/衬底结构在超燃冲压发动机传感器、发电、制冷和热能回收利用等领域的应用引起了人们的极大关注，涉及不同性质的衬底。本文提出并研究了有或无粘结层的热电薄膜与正交异性衬底粘结的理论模型。综合分析了热电薄膜、正交异性衬底以及粘结层的各种几何和材料参数对界面应力场和应力强度因子的影响。研究发现，选择热导率高、长度小的热电薄膜有利于热电薄膜/正交异性衬底体系的稳定性。通过调整正交各向异性衬底的有效参数，可以减轻膜/衬底系统端部可能的损伤。设计一层厚而柔软的粘结层有助于热电薄膜/衬底系统的安全。研究结果对热电材料的广泛应用以及工程实践中各种薄膜/衬底结构的设计具有重要意义。
The thermoelectric film/substrate structure has recently drawn great attention due to various applications in fields of sensors in scramjet engines, power generation, refrigeration and reutilization of heat energy, which involves substrates of different properties. In this paper, a theoretical model of a thermoelectric film bonded to an orthotropic substrate with or without a bonding layer is proposed and studied. The interfacial stress field, and the stress intensity factors influenced by various geometric and material parameters of the thermoelectric film and the orthotropic substrate, as well as the bonding layer are comprehensively analyzed. It is found that selecting thermoelectric films with high thermal conductivity and small length facilitates the stability of the thermoelectric film/orthotropic substrate system. The possible damage at the ends of the film/substrate system can be alleviated by tuning effective parameters of the orthotropic substrate. Designing a thick and soft bonding layer can be helpful for the safety of the thermoelectric film/substrate system. The results should be of significant importance for the blooming applications of thermoelectric materials, as well as the design of various film/substrate structures in engineering practice.