In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy
In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy
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DOI：
10.1063/1.4939771
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发表时间：
2016-01
影响因子：
4
通讯作者：
M. Egawa;T. Ishida;L. Jalabert;H. Fujita
中科院分区：
文献类型：
--
作者：
M. Egawa;T. Ishida;L. Jalabert;H. Fujita
利用安装在扫描电子显微镜上的微制液池，研究了金电极间纳米级电镀的动力学。现场记录电镀10min，空间分辨率高于6 nm。在电镀初期，电极上生长出大小约为50 nm的金钉状结构，并将其周围的金纳米团簇连接在一起，形成三维纳米结构。我们可视化了电镀金的基本过程，并相信这些结果将有助于在纳米尺度上对电镀的更深层次的理解。
The dynamics of nanoscale electroplating between gold electrodes was investigated using a microfabricated liquid cell mounted on a scanning transmission electron microscope. The electroplating was recorded in-situ for 10 min with a spatial resolution higher than 6 nm. At the beginning of the electroplating, gold spike-like structures of about 50 nm in size grew from an electrode, connected gold nanoclusters around them, and form three dimensional nanoscale structures. We visualized the elementary process of the gold electroplating, and believe that the results lead to the deeper understanding of electroplating at the nanoscale.