Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts
Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts
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DOI：
10.1007/s00542-008-0675-3
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发表时间：
2008-11-01
影响因子：
2.1
通讯作者：
Poprawe, R.
中科院分区：
文献类型：
--
作者：
Sari, F.;Hoffmann, W. -M.;Poprawe, R.
微型技术的连接工艺必须满足有关部件的机械和热负荷及其对准精度的特殊要求。对于这些应用，激光辐射作为能量源非常适合以最小的能量负载连接到零件上。特别地，激光透射接合用于使用不同材料的全部或部分透射来接合塑料、硅或玻璃，并且在部件内部执行隐藏接合。由于材料的光学性能对这种连接技术起着决定性的作用，因此优化吸收体和材料条件对于高质量的连接至关重要。对塑料微焊接的不同吸收性染料的研究显示了它们的适用性，但也显示了这些材料的局限性。对于硅和玻璃以及硅和硅，具有工艺适应性波长和策略的新光纤激光器已经被研究并被鉴定为微组装中的多功能工具。
Joining processes for microtechnology must fulfil special requirements concerning mechanical and thermal load of the components as well as their alignment accuracy. For these applications laser radiation as an energy source is ideally suited for joining with a minimum of energy load to the parts. In particular, laser transmission joining is used for joining plastics, silicon or glass using the total or partial transmission of the different materials and performing hidden joints inside a component. Since the optical properties of the materials play a decisive role for this joining technology, an optimization of absorbers and material conditions is of crucial importance for high quality joints. Investigations on different absorbent dyes for micro welding of plastics show their applicability, but also the limitations of these materials. For silicon and glass as well as silicon and silicon new fiber lasers with process-adapted wavelengths and strategies have been investigated and qualified as a versatile tool in micro assembly.