Moiré interferometry for engineering mechanics: Current practices and future developments

Moiré interferometry for engineering mechanics: Current practices and future developments
复制标题

DOI:
10.1243/0309324011512568
复制
发表时间:
2001-01
期刊:
The Journal of Strain Analysis for Engineering Design
影响因子:
--
通讯作者:
B. Han;D. Post;P. Ifju
B. Han;D. Post;P. Ifju
中科院分区:
其他
文献类型:
--
作者:
B. Han;D. Post;P. Ifju

文献摘要

被引文献

相似文献

在过去的十年里,被称为云纹干涉的光学方法迅速成熟,成为一种无价的工具,许多工业和科学应用都证明了这一点。它已被应用于工程力学中的许多问题。它测量的面内位移场具有高灵敏度和高空间分辨率。本文综述了云纹干涉术及其推广应用的现状。在不同领域的应用表明了该方法的广泛适用性,特别是在微电子器件热变形分析方面的最新应用。对未来的发展和实践进行了推测。
In the past decade, the optical method called moire interferometry has matured rapidly to emerge as an invaluable tool, proved by many industrial and scientific applications. It has been applied to numerous problems in engineering mechanics. It measures in-plane displacement fields with high sensitivity and high spatial resolution. This paper reviews current practices of moire interferometry and its extensions. Applications in diverse fields are addressed to demonstrate the wide applicability of the method, especially the recent applications for thermal deformation analyses of microelectronics devices. Speculation on future developments and practices is presented.