Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder.
Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder.
复制标题
使用十六烷硫醇钯作为原位焊料的具有欧姆接触的自组装 CNT 电路。
作者：
T. Bhuvana;Kyle C Smith;T. Fisher;G. U. Kulkarni
提出了一种使用钯的金属有机前体（即十六硫醇钯）制造 CNT 纳米电路的简单而优雅的方法。该前驱体引导单个碳纳米管自组装，跨越金电极之间的间隙。这是通过首先沿着间隙电极的边缘对前体进行图案化来实现的，因为它能够通过电子束直接图案化。此外，前体在 250 摄氏度下的热激活导致金属化以及 CNT 和下面的电极之间的欧姆电接触。还观察到焊接碳纳米管的电阻熔丝作用。
An easy and elegant method of CNT nanocircuit fabrication using a metal organic precursor of Pd, namely, Pd hexadecanethiolate, is presented. This precursor directs the self-assembly of individual CNTs spanning a gap between Au electrodes. This is achieved by first patterning the precursor along the edges of the gap electrodes, as it enables direct patterning by e beam. Further, thermal activation of the precursor at 250 degrees C leads to metallization and the ohmic electrical contact between the CNTs and the electrodes beneath. A resistive fuse action of the soldered CNTs is observed as well.