MANIPULATION OF THE WETTABILITY OF SURFACES ON THE 0.1-MICROMETER TO 1-MICROMETER SCALE THROUGH MICROMACHINING AND MOLECULAR SELF-ASSEMBLY
MANIPULATION OF THE WETTABILITY OF SURFACES ON THE 0.1-MICROMETER TO 1-MICROMETER SCALE THROUGH MICROMACHINING AND MOLECULAR SELF-ASSEMBLY
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DOI：
10.1126/science.257.5075.1380
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发表时间：
1992-09-04
期刊：
影响因子：
56.9
通讯作者：
WHITESIDES, GM
中科院分区：
文献类型：
--
作者：
ABBOTT, NL;FOLKERS, JP;WHITESIDES, GM
微机械加工允许在支持烷硫醇盐的自组装单层（SAM）的金膜的表面上形成裸金的微米级区域。第二SAM形成的微加工表面上时，整个系统-其余的未受干扰的金支持的SAM和裸露的金微加工功能-暴露于二烷基二硫化物的溶液。通过从HS（CH 2）15 COOH制备初始亲水性SAM，将特征微加工到该SAM中，并用由[CH 3（CH 2）11 S]2形成的疏水性SAM覆盖这些特征，可以在亲水性表面中构建微米级疏水线。这些线提供了新的结构，用它来操纵液滴的形状。
Micromachining allows the formation of micrometer-sized regions of bare gold on the surface of a gold film supporting a self-assembled monolayer (SAM) of alkanethiolate. A second SAM forms on the micromachined surfaces when the entire system-the remaining undisturbed gold-supported SAM and the micromachined features of bare gold-is exposed to a solution of dialkyl disulfide. By preparing an initial hydrophilic SAM from HS(CH2)15COOH, micromachining features into this SAM, and covering these features with a hydrophobic SAM formed from [CH3(CH2)11S]2, it is possible to construct micrometer-scale hydrophobic lines in a hydrophilic surface. These lines provide new structures with which to manipulate the shapes of liquid drops.