Microstructural evolution in copper processed by severe plastic deformation
Microstructural evolution in copper processed by severe plastic deformation
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DOI：
10.1016/j.msea.2005.08.201
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发表时间：
2005-11
期刊：
影响因子：
6.4
通讯作者：
A. Mishra;V. Richard;F. Grégori;R. Asaro;M. Meyers
中科院分区：
文献类型：
--
作者：
A. Mishra;V. Richard;F. Grégori;R. Asaro;M. Meyers
连续通过后，研究了等通道角挤压 (ECAP) 铜的微观结构演变机制。前几次道次对于晶粒细化是最有效的，而随着道次次数的增加，微观结构逐渐变得更加等轴。基于电子背散射衍射（EBSD）结果讨论了织构演化。这些实验结果根据具有四个连续阶段的初步模型进行解释：均匀位错分布；拉长的亚细胞形成；细长的亚晶粒形成；亚晶粒破碎成等轴单位；晶界锐化和最终等轴超细结构。
The mechanisms of microstructural evolution in copper subjected to equal channel angular pressing (ECAP) have been investigated after successive passes. The first few passes are the most efficient in grain refinement while the microstructure becomes gradually more equiaxed as the number of passes increases. The texture evolution is discussed based on electron back scattered diffraction (EBSD) results. These experimental results are interpreted in terms of a preliminary model with four successive stages: homogeneous dislocation distribution; elongated sub-cell formation; elongated subgrain formation; break-up of subgrains into equiaxed units; sharpening of grain boundaries and final equiaxed ultrafine structure.