The initial stages of copper deposition on bare and chemically modified gold electrodes
The initial stages of copper deposition on bare and chemically modified gold electrodes
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裸金电极和化学改性金电极上铜沉积的初始阶段
DOI：
10.1002/(sici)1521-396x(199905)173:1
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
D. Kolb
中科院分区：
文献类型：
--
作者：
M. Schneeweiss;D. Kolb
本文概述了电解金属沉积初期的各个方面，并以经典模型体系CuOOAu(HKL)为例进行了论证。对欠电位沉积和过电位沉积进行了描述，指出了一些控制形核和生长的参数。展示了衬底取向的深刻影响，并列举了有机添加剂对沉积过程影响的各种例子。最近，金属沉积在自组装单分子膜覆盖的电极上作为一种可能的金属沉积在非导电搅拌面上的模型系统受到了越来越多的关注，因此，本文给出了在烷硫醇覆盖的Au(111)表面沉积铜的初步结果。
This paper comprises, in the form of an overview, various aspects of the initial stages of electrolytic metal deposition, demonstrated and exemplified by the classical model system, Cu on Au(hkl). Describing underpotential as well as overpotential deposition, some of the parameters governing nucleation and growth are pointed out. The profound effect of substrate orientation is shown and various examples of the influence of organic additives on the deposition process are given. Most recently, metal deposition onto electrodes covered with self-assembled monolayers has received increased attention as a possible model system for metal deposition onto a non-conducting stirface and therefore, preliminary results for Cu deposition on alkanethiol covered Au(111) are presented.