Micromechanics of composites with interface effects
Micromechanics of composites with interface effects
复制标题
具有界面效应的复合材料微观力学
DOI：
10.1007/s10409-022-22025-x
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发表时间：
2022-04
影响因子：
3.5
通讯作者：
Zhuping Huang
中科院分区：
文献类型：
--
作者：
Huiling Duan;Jianxiang Wang;Zhuping Huang
Interfaces that exist in composites greatly influence their mechanical and conductive properties. There are usually three interface models to characterize the elastic and conductive properties of the interface in composites. For elastic problems, they are the interface stress model (ISM), linear spring model (LSM), and interphase model. For conductive problems, they are the high conducting (HC) interface model, low conducting (LC) interface model, and interphase model. For elastic problems with the interface effects, they can be divided into two types. The first kind of elastic problem concerns the solution of boundary value problems and aims to predict the effective properties of composites with interface effects. The second kind of elastic problem concerns the surface/interface stress effects on the elastic properties of nanostructured materials, which is usually characterized by the ISM. In this paper, three aspects in the elastic problems with interface effects are first reviewed, i.e., equivalent relations among the three interface models, Eshelby formalism, and micromechanical frameworks. Special emphasis is placed on the ISM to show how classical models can be extended to the nano-scale by supplementing the interface elasticity to the basic equations of the classical elastic problems. Then, the conductive problems of the composites with the interface effects are also reviewed, and the general frameworks for predicting the effective conductivity of the composites are given. Finally, scaling laws depicting the size-dependent elastic and conductive properties of the composites are discussed.
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影响因子：
4
作者：
Lei He
通讯作者：
Lei He
影响因子：
5.3
作者：
H. Duan;B. Karihaloo
通讯作者：
H. Duan;B. Karihaloo
DOI：
10.1115/1.3167617
发表时间：
1984-06
期刊：
Journal of Applied Mechanics
影响因子：
--
作者：
T. Mura;R. Furuhashi
通讯作者：
T. Mura;R. Furuhashi
影响因子：
3.2
作者：
D. Duschlbauer;H. Pettermann;H. Böhm
通讯作者：
D. Duschlbauer;H. Pettermann;H. Böhm
影响因子：
9.8
作者：
M. Linne;T. Bieler;S. Daly
通讯作者：
M. Linne;T. Bieler;S. Daly