The Effect of Solid-State Reactions Upon Solder Lap Shear Strength
The Effect of Solid-State Reactions Upon Solder Lap Shear Strength
复制标题
固态反应对焊料搭接剪切强度的影响
DOI：
10.1109/tphp.1977.1135211
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发表时间：
1977
期刊：
影响因子：
--
通讯作者：
C. Wright
中科院分区：
文献类型：
--
作者：
C. Wright
研究了镀金层与88Au：12Ge、80Au：20Sn、90Sn：10Au、85Pb：15Au共晶焊料以及非共晶焊料60SN：36Pb：4Ag之间的固相反应对搭接剪切强度的影响。搭接剪切样品的失效分析表明，Au-Ge和Au-Sn焊料粘结失效，而SnAu-Au、PbAu和SnPbAg焊料粘结失效。在125℃时效的金-焊料金相样品的扫描电子显微镜和微探针分析表明，在锡-金焊料的电镀-焊料界面上存在AuSn2、AuSn2、AuSn4和空洞。在SnPbAg焊料界面检测到AuSn2和AuSn4金属间化合物，在PbAu焊料界面检测到AuPb2金属间化合物。在Au-Sn焊料的电镀-焊料界面处检测到Au-Sn二元系的Zeta相。Au-Ge焊料的电镀-焊料界面没有任何中间相或金属间化合物。搭接剪切测量的结果表明，当匹配材料具有相似的热膨胀系数时，在<；100°C的持续温度下，所有五种焊料都有望表现出足够的强度，用于微电子目的>；105h。然而，由于具有不同的热膨胀系数，SnAu和SnPbAg焊料在100℃的103h内都发生了灾难性的失效
The effect of solid-state reactions between gold plating and the eutectic solders 88Au:12Ge, 80Au:20Sn, 90SN:10Au, and 85Pb: 15Au and the off eutectic solder 60SN:36Pb:4Ag upon the solder lap shear strength has been investigated at four aging temperatures ranging from 75 to 150°C. Failure analysis of the lap shear samples has shown that Au-Ge and Au-Sn solders failed cohesively whereas Sn-Au, Pb-Au, and Sn-Pb-Ag solders failed adhesively. Scanning electron micrographs and microprobe analysis of gold-solder metallographic sampies aged at 125°C revealed the presence of AuSn, AuSn 2 , AuSn 4 , and voids at the plating-solder interface of Sn-Au solder. AuSn 2 and AuSn 4 intermetallic compounds were detected at the interface of SnPb-Ag solder, and AuPb 2 was detected at the interface of Pb-Au solder. The zeta phase of the Au-Sn binary system was detected at the plating-solder interface of the Au-Sn solder. The plating-solder interface of the Au-Ge solder was devoid of any intermediate phases or intermetallic compounds. The results of the lap shear measurements have shown that all five solders can be expected to exhibit adequate strength for microelectronic purposes for >105h at a sustained temperature of <100°C when the mating materials have similar coefficients of thermal expansion. However, with dissimilar thermal expansion coefficients, the SnAu and Sn-Pb-Ag solders both failed catastrophically within 103h at 100°C