A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
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粘膜非冶金接触接头结构的高可靠设计
DOI：
10.1115/1.1648059
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发表时间：
2004
影响因子：
1.6
通讯作者：
I. Yoshida
中科院分区：
文献类型：
--
作者：
N. Tanaka;K. Kawano;H. Miura;Y. Kado;I. Yoshida
根据芯片凸块和衬底焊盘之间的接触面处的压缩力的稳定性，评估具有各向异性导电膜（ACF）或非导电膜（NCF）的接触接合结构的互连可靠性。在温度循环过程中，控制互连可靠性的关键因素是接触面处芯片凸块（金凸块）中的塑性应变量。因此，必须通过选择粘合剂膜（ACF或NCF）和积层基板材料的适当机械性能来控制芯片凸块的塑性变形。此外，在耐湿性测试过程中的互连可靠性恶化，因为应力松弛附近的玻璃化转变温度的常用的内置材料。因此，应开发一种新的材料体系，其中包括防止应力松弛的增层材料的力学性能
The interconnection reliability of a contact-joint structure with anisotropic conductive film (ACF) or non-conductive film (NCF) was evaluated in terms of stability of the compressive force at the contact face between a chip bump and a substrate pad. The key factor that dominates the interconnection reliability during temperature cycling is the amount of plastic strain in the chip bump (gold bump) at the contact face. The plastic deformation of the chip bump must therefore be controlled by selecting the appropriate mechanical properties of the adhesive film (ACF or NCF) and the build-up substrate material. Moreover, the interconnection reliability during moisture-resistance tests deteriorates because of stress relaxation near the glass-transition temperature of the commonly used build-up material. It is therefore concluded that a new material system, which includes the mechanical property of the build-up material for preventing stress relaxation, should be developed