Elastic recoil detection analysis (ERDA), RBS and TEM study of barrier film formation on Al–4.5 at.% Mg–0.05 at.% Cu alloy
Elastic recoil detection analysis (ERDA), RBS and TEM study of barrier film formation on Al–4.5 at.% Mg–0.05 at.% Cu alloy
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Al–4.5 at.% Mg–0.05 at.% Cu 合金上阻挡膜形成的弹性反冲检测分析 (ERDA)、RBS 和 TEM 研究
DOI：
10.1002/(sici)1096-9918(199901)27:1
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
K. Shimizu
中科院分区：
文献类型：
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作者：
G. Thompson;P. Skeldon;G. Wood;Xiaorong Zhou;U. Kreissig;E. Wieser;H. Habazaki;K. Shimizu
研究了镁对Al-4.5at. % Mg-0.05at.% Al-1.05at.% Mg合金上阻挡型阳极氧化膜形成的影响用弹性反冲分析、卢瑟福背散射谱和分析透射电子显微镜对铜合金进行了研究。结果表明，镁物种均匀地分布在整个阳极氧化铝膜中，镁物种在膜中向外迁移的速度约为Al 3+离子的两倍。在到达膜表面时，镁物质在阳极氧化的特定条件下被喷射到电解质中，而Al 3+离子被保留在膜内。Mg的氧化导致合金/薄膜界面处出现空洞，这可能与Mg/MgO的Pilling-Bedworth比相对于Al/Al 2 O3的Pilling-Bedworth比较低有关在阳极氧化膜下方的合金区域中，Cu原子高度富集（达到1.0 × 1019 Cu原子m-2），并且在整个阳极氧化膜中存在Cu物种（其向外迁移的速度比Al 3+离子更快），从而形成空洞。
The influences of magnesium upon the formation of barrier-type anodic films on an Al-4.5 at% Mg-0.05 at.% Cu alloy have been examined by elastic recoil detection analysis, Rutherford backscattering spectroscopy and analytical transmission electron microscopy. The results reveal that magnesium species are distributed uniformly throughout the anodic alumina film, with magnesium species migrating outwards in the film approximately twice as fast as Al 3+ ions. Upon reaching the film surface, the magnesium species are ejected into the electrolyte under the particular conditions of anodizing, whereas Al 3+ ions are retained within the film. The oxidation of magnesium results in voids at the alloy/film interface, which are probably associated with the low Pilling-Bedworth ratio of Mg/MgO relative to that of Al/Al 2 O 3 . The voids are formed in the presence of a high enrichment of copper (to 1.0 × 10 19 Cu atoms m -2 ) in the alloy region immediately beneath the anodic film, with copper species (which migrate outward faster than Al 3+ ions) present throughout the anodic film.