Modelling of contact regimes in wire sawing with dissipative particle dynamics
Modelling of contact regimes in wire sawing with dissipative particle dynamics
复制标题
利用耗散粒子动力学对线锯中的接触状态进行建模
DOI：
10.1098/rsta.2010.0361
复制
发表时间：
2011
期刊：
影响因子：
--
通讯作者：
M. Moseler
中科院分区：
文献类型：
--
作者：
C. Bierwisch;R. Kübler;G. Kleer;M. Moseler
硅锭线切割工艺的优化需要对线切割、料浆和硅材料的动态相互作用有深刻的认识。本文采用耗散粒子动力学和离散元模拟方法对磨料悬浮液中的流体和颗粒进行了模拟，研究了线速度和外加线应力对这一过程的影响。在我们的模拟中，不同的接触机制取决于颗粒形状和系统内的应力平衡。我们观察到高钢丝应力和低钢丝速度的半接触和低应力和高速度的非接触，这与弹性流体动力学模型的预测一致。我们的模拟建议使用锋利的颗粒，因为在这种情况下，即使在非接触状态下，锯槽底部的应力局部化也会发生。这些见解可能为优化锯切速度和减少切口损失提供科学依据。
Optimization of the wire sawing process of silicon ingots requires a profound understanding of the dynamic interaction of wire, slurry and silicon material. In this paper, the influence of wire velocity and applied wire stress on the process is investigated using dissipative particle dynamics and discrete element simulations for modelling the fluid and the grains in the abrasive suspension. In our simulations, different contact regimes occur depending on grain shape and a stress balance within the system. We observed semi-contact for high wire stress and low wire velocity and non-contact for low stress and high velocities in agreement with predictions from elasto-hydrodynamic modelling. Our simulations suggest the usage of sharp grains, since in this case, stress localization on the base of the sawing groove occurs even in the non-contact regime. These insights are likely to provide a scientific base for the optimization of sawing rates and reduction of kerf loss.
DOI：
10.1209/0295-5075/19/3/001
发表时间：
1992-06-01
期刊：
EUROPHYSICS LETTERS
影响因子：
--
作者：
HOOGERBRUGGE, PJ;KOELMAN, JMVA
通讯作者：
KOELMAN, JMVA