Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
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DOI：
10.1109/jstqe.2010.2071855
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发表时间：
2011-05-01
影响因子：
4.9
通讯作者：
Tekin, Tolga
中科院分区：
文献类型：
--
作者：
Kopp, Christophe;Bernabe, Stephane;Tekin, Tolga
硅光子学是一种新技术，它至少应该能够使电子和光学集成在同一个光电子电路芯片上，从而利用微电子行业的标准工艺在硅片上生产低成本的设备。为了实现真正的低成本器件，需要在光学与电子的集成工艺和芯片的封装方面提出一些挑战。本文综述了硅光子电路封装的最新进展，从片上集成到单芯片封装和输入/输出互连。我们将重点放在光纤耦合结构上，对边缘和表面耦合器进行比较。在下文中，我们详细介绍了两种耦合结构的光学对准公差，从封装工艺的角度讨论了其优缺点。最后，我们描述了一些涉及先进封装技术的成果。
Silicon photonics is a new technology that should at least enable electronics and optics to be integrated on the same optoelectronic circuit chip, leading to the production of low-cost devices on silicon wafers by using standard processes from the microelectronics industry. In order to achieve real-low-cost devices, some challenges need to be taken up concerning the integration technological process of optics with electronics and the packaging of the chip. In this paper, we review recent progress in the packaging of silicon photonic circuits from on-CMOS wafer-level integration to the single-chip package and input/output interconnects. We focus on optical fiber-coupling structures comparing edge and surface couplers. In the following, we detail optical alignment tolerances for both coupling architecture, discussing advantages and drawbacks from the packaging process point of view. Finally, we describe some achievements involving advanced-packaging techniques.