Preliminary Experimental Study of Countercurrent Through- Hole Plating of Printed Circuit Boards

这个加速小说研究奖是为了支持一个 快速均匀电镀示范实验 非常小的孔的内表面。 这些洞密集地出现在 包装印刷电路板，必要的铜沉积， 要么缓慢而均匀，要么快速而不均匀。 所提出的系统诱导电解质的适当流动通过 该孔通过压力驱动流和流动驱动流的组合 通过在孔内旋转的螺旋槽电极。 研究 是对这一概念的探索性评估。

This Expedited Award for Novel Research is in support of a demonstration experiment on the rapid and uniform electroplating of the inside surface of very small holes. These holes occur on densely packed printed circuit boards, and the necessary copper deposition has been either slow and uniform, or rapid and non-uniform. The proposed system induces an appropriate flow of electrolyte through the hole through a combination of pressure-driven flow and flow driven by a helically fluted electrode spinning inside the hole. The study is an exploratory assessment of this concept.