Research Initiation Award: The Role of Transport Phenomena in Soldering Processes

CTS-9309530纽约州立大学宾汉姆顿分校Timothy J. Singler 摘要 微电子制造技术的发展速度超过了焊接技术。 焊接的过程是要检查重点是更好地了解潜在的传输现象。 集成的实验和理论方法将集中在接头形状预测，焊料缺陷分析和反应润湿，以改善焊接技术。 焊接在整个电子工业中非常重要。 焊接技术的进步可以降低故障率，提高生产率或保持性能，同时更好地解决环境问题。

CTS-9309530 State University of New York-Binghamton Timothy J. Singler ABSTRACT Fabrication techniques in microelectronics has outpaced developments in soldering. The process of soldering is to be examined with emphasis on greater understanding of the underlying transport phenomena. Integrated experimental and theoretical approaches will focus on joint shape prediction, solder defect analysis and reactive wetting to improve soldering technology. Soldering is important throughout the electronics industry. Advances in soldering could reduce failure rates to increase productivity or maintain performance while better addressing environmental considerations.