Energy Transfer and Trapping in Hyperthermal Energy Alkali and Reactive Ion Collisions with Surfaces

9313818库珀拟议工作的中心目标是建立高热离子-表面碰撞中散射和电荷转移动力学的定量模型。本文主要研究碱性离子在铜表面的散射，作为研究这些动力学的模型系统。测量了散射正离子和中性离子的能量分布和角分布。弹道模拟将用于测试散射模型和势能，并确定能量转移和捕获机制。能谱峰宽将被用来研究表面原子结合力。其他技术，包括俄歇电子能谱，将被用来研究捕获概率随离子和表面物种、能量和几何形状的函数而变化的趋势。将开发新的模拟能力来确定诱捕机制。散射中性和离子通量的比较将被用来确定中和概率，并调查电荷转移在碰撞和俘获动力学中的作用。提出了新的实验和模拟能力，使研究反应离子-表面碰撞的碰撞、电荷转移和俘获动力学成为可能。将用俄歇显微镜和扫描隧道显微镜研究俘获趋势和覆盖层沉积。从这些研究中获得的信息将有助于对表面处理和薄膜沉积中发生的相互作用进行建模。这些信息也可以用来优化这些技术。***

9313818 Cooper The central objective of the proposed work is to develop quantitative models of the scattering and charge transfer dynamics in hyperthermal ion-surface collisions. The proposed work is focussed on the scattering of alkali ions from copper surfaces as model systems to study these dynamics. Both the energy and angular distributions of scattered positive ions and neutrals are measured. Trajectory simulations will be used to test scattering models and potentials, and determine energy transfer and trapping mechanisms. Energy spectra peak widths will be used to study surface atom binding forces. Additional techniques, including Auger Electron Spectroscopy, will be used to study trends in the trapping probabilities as a function of ion and surface species, energy, and geometry. New simulation capabilities will be developed to determine trapping mechanisms. Comparisons of scattered neutral and ion fluxes will be used to determine neutralization probabilities and investigate the role of charge transfer in the collision and trapping dynamics. New experimental and simulation capabilities are proposed to enable the study of the collision, charge transfer and trapping dynamics of reactive ion-surface collisions. Trapping trends and overlayer deposition will be studied with Auger and scanning tunneling microscopy. The information obtained from these studies will be useful for modeling the interactions that occur in surface processing and thin film deposition. Such information could also be used to optimize these techniques. ***