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SBIR Phase I: Boundary Scan and Board-Level Built-In-Self- Test Insertion into VHDL Designs with Commercial-off-the- Shelf Components

SBIR Phase I: Boundary Scan and Board-Level Built-In-Self- Test Insertion into VHDL Designs with Commercial-off-the- Shelf Components
SBIR 第一阶段:使用商用现成组件将边界扫描和板级内置自测试插入到 VHDL 设计中
批准号:
9661504
负责人:
Casper Stoel
金额:
$7.5万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1997
资助国家:
美国
项目状态:
已结题
起止时间:
1997-01-01 至 1997-06-30

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中文摘要
翻译
9661504斯托尔这个小型企业创新研究(SBIR)第一阶段项目是为了满足电子行业日益缩短的上市时间对商业现成(COTS)组件日益增长的需求。COTS组件很容易获得,价格较低,并提高了设计过程的效率,但对可测试性产生了负面影响。建议开发一种提高使用COTS设备实现的电路板和系统的可测试性的方法,并提供支持工具。该方法将通过(1)实现板级JTAG边界扫描,(2)借用某些芯片包含的边界扫描来测试周围的COTS元件而不进行边界扫描,以及(3)利用1149.1标准边界扫描串口集成其他测试和诊断技术,如板级内建自测试和IDDQ测试,从而提高板级测试的可控性和可观测性。行业标准(VHDL语言和边界扫描)支持与主要EDA框架的互操作性。在第一阶段,将为更高级别(电路板、多芯片模块等)开发原型工具集。VHDL语言设计中的边界扫描和BIST插入。在第二阶段,工具集的特性和功能将得到扩展,产品将开始商业化。建议的测试插入方法为设计人员面临的紧迫问题提供了解决方案,他们的设计要求包括高可测试性和使用不可测试的COTS组件。新的工具集将通过使用商业部件降低设计阶段的成本和节省时间,而不会对可测试性造成影响。
英文摘要
9661504 Stoel This Small Business Innovative Research (SBIR) Phase I project is to meet the increasing need for commercial-off-the-shelf (COTS) components in the ever shrinking time to market in the electronics industry. COTS components are readily available, less expensive, and increase efficiency of the design process, but negatively impact testability. It is proposed to develop a methodology for enhancing testability of boards and systems implemented using COTS devices, and to provide the supporting tools. The methodology will improve controllability and observabilitv in such board testing through (1) implementation of board-level JTAG boundary scan, (2) borrowing boundary scan included on some chips to test surrounding COTS components without boundary scan, and (3) integrating other test and diagnostic techniques such as board-level built-in self test (BIST) and IDDQ test using the 1149.1 standard boundary scan serial interface. Industry standards (VHDL and Boundary Scan) support interoperabilitv with major EDA frameworks. During Phase I, a prototype tool set will be developed for higher level (board, Multi-Chip Module, etc.) boundary scan and BIST insertion into VHDL designs. In Phase II, tool set features and capabilities will be expanded, and product commercialization will begin. The proposed test insertion methodology provides a solution to pressing problems faced by designers whose design requirements include high testability and use of untestable COTS components. The new tool set will lower cost and save time in the design phase through use of commercial parts without the attendant compromises in testability.
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