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Engineering Foundation Conference on Microgravity Fluid Physics and Heat Transfer to be held September 19-24, 1999 in Oahu, Hawaii

Engineering Foundation Conference on Microgravity Fluid Physics and Heat Transfer to be held September 19-24, 1999 in Oahu, Hawaii
微重力流体物理和传热工程基础会议将于 1999 年 9 月 19 日至 24 日在夏威夷瓦胡岛举行
批准号:
9820877
负责人:
Vijay Dhir
金额:
$1.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1999
资助国家:
美国
项目状态:
已结题
起止时间:
1999-04-15 至 2000-03-31

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中文摘要
翻译
这项拨款将支持美国科学家参加1999年9月19日至24日在夏威夷瓦胡岛举行的微重力流体物理和传热工程基金会会议。在过去的几年里,许多研究人员一直在进行研究,以了解重力降低下各种运输现象的作用。在航天飞机上进行了长时间微重力下的实验。这些实验为微重力条件下各种现象的物理学提供了见解,但在某些情况下,也证明了对这些现象缺乏理解。会议将提供一个论坛,以综合在微重力传热方面已经发展起来的知识库,并在隔离未来研究中需要解决的关键问题。技术会议将讨论液滴、气泡和颗粒;池和流沸腾;流动形式和两相压降;热毛细管流动,生物流体力学;界面现象;液体管理;还有热管。会议记录将在会议结束后六个月内出版。
英文摘要
This grant will support participation by US scientists at the Engineering Foundation Conference on Micro- gravity Fluid Physics and Heat Transfer in Oahu, Hawaii, September 19-24, 1999. Over the last several years many investigators have been carrying out research to understand the role of various transport pheno- mena under reduced gravity. Experiments have been performed on the Space Shuttle under prolonged duration of microgravity. These experiments have provided insight into the physics of various phenomena under microgravity conditions and in some cases have demonstrated the lack of understanding of the phenomena. The conference will provide a forum for the synthesis of the knowledge base that has been developed in micro- gravity heat transfer and in isolating the key issues that need to be addressed in future research. Technical sessions will be on drops, bubbles, and particles; pool and flow boiling; flow regimes and two phase pressure drop; thermocapillary flows, bio-fluid mechanics; interfacial phenomena; fluid management; and heat pipes. The proceedings will be published within six months of the conference.
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会议论文
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U.S. - Japan Seminar on Two-Phase Flow Dynamics
Travel to Attend Third ISHMT/ASME Heat and Mass Transfer Conference and to Strengthen US-India Cooperative Research
Numerical Simulation of Vapor-Liquid Interfaces During Saturated and Subcooled Film Boiling
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