Student Travel Grant for 1999 Fiber-Optics Optoelectronic Photonics Assemby Packaging Manufacturing: An Interactive Workshop in Vail, CO, September 15-17, 1999

组织这次会议是为了让工业界和大学的光电子界聚集一堂，讨论光电子组装、包装和制造方面的问题。研讨会将于1999年8月15日至17日在科罗拉多州的韦尔举行。研讨会的目标是开发下一代光纤、光电子学和光子组件和系统的组装、封装和制造技术的最新要求。邀请和贡献的演讲将包括MEM技术、新材料、自动化、光学微型工作台、热管理、VCSEL阵列、WDM组件、衍射光学元件、微过滤器等的应用。学生将受益于在研讨会上展示他们的研究成果，与行业互动，并有机会寻找未来的就业机会。NSF的资金将用于支持学生参加会议。

The conference has been organized to bring together the industrial and university photonics community to discuss issues on Optoelectronoc Assembly, Packaging and Manufacturing. The workshop will be held in Vail, Colorado, Sepltember 15 to 17, 1999. The goal of the workshop is to develop up-to-date requirements for assembly, packaging, and manufacurturing technologies for next generation fiber-optics, optoelectronics and photonic components and systems.Invited and contributed presentations will include application of MEM technologies, new materials, automation, optical micro-bench, thermal management, VCSEL arrays, WDM components, diffractive optical elements, micro-filter, etc. Students will benefit by presenting their research results in the workshop, interacting with industries, and having an opportunity to seek future employment. The NSF funds will be used to support student travel to the conference.