Magnetically Assisted CMP of Low-K Polymers

在集成电路制造中，化学机械平坦化(CMP)用于将铝、钨、钽和铜等导体以及二氧化硅、氮化硅和Low-k聚合物等介质表面平坦化。化学机械抛光工艺是目前唯一可用的技术，可以提供横跨芯片和晶片的表面，其平坦度足以满足较短波长光刻技术对聚焦深度的严格要求。覆盖在这些聚合物上的低k聚合物材料和结构的化学机械抛光具有挑战性。这是因为低K聚合物材料在机械上更柔软，甚至是多孔的，可以在热下流动，并且具有疏水表面。目前迫切需要开发低压、选择性和高效的化学机械抛光工艺来制备新型的低k聚合物和覆盖在这些聚合物上的结构。该计划的主要目标是开发一种新的方法，使用磁响应性浆料(MRS)来进行低k聚合物及其相关结构的化学机械抛光。该项目是克拉克森大学和匹兹堡大学的研究人员与工业界合作的联合协作、跨学科、协同努力。将对这种磁辅助CMP工艺的可行性进行基础和系统的研究。这一计划的结果有可能带来显著的经济回报。该项目将对构成化学变化框架公约技术基础的基础科学、研究基础设施和人力资源开发产生重大的综合影响。

In IC fabrication chemical mechanical planarization (CMP) is used to planarize surfaces ofconductors like aluminum, tungsten, tantalum and copper and dielectrics like silicon dioxide,silicon nitride, and low-k polymers. The CMP process is the only technique available now toprovide surfaces across the die and wafer with planarity sufficient to meet the stringent depth offocus requirements of shorter wavelength lithographic techniques. The CMP of low-k polymericmaterials and architectures overlaid on these polymers is challenging. This is because the low-kpolymeric materials are mechanically softer and even porous, can flow under heat, and havehydrophobic surfaces. There exists a critical need for developing low pressure, selective, andeffective CMP process of the new, low-k polymers and architectures overlaid on these polymers.The primary objective of this program is to develop a novel approach using magneticallyresponsive slurries (MRS) to conduct CMP of low-k polymers and associated structures. Theproject is a joint collaborative, interdisciplinary, synergistic effort between investigators fromClarkson University and University of Pittsburgh, with collaboration with industry. Afundamental and systematic investigation of the feasibility such a magnetically assisted CMPprocess will be conducted. The outcome of this program has the potential for a significantly higheconomic payoff. This project will have significant combined impact on the: basic science thatforms the underpinning of the CMP technology, research infrastructure, and development ofhuman resources.