Thermal Challenges in Next Generation Electronic Systems: THERMES 2002

摘要2002年热管理研讨会将集中讨论热管理和表征方案的最新进展，以及对未来趋势的预测和分析。 会议将于2002年初在新墨西哥州圣达菲举行。 从芯片到最终系统，在电子产品的各个层次上，热问题都是电子产品开发的关键。系统尺寸的缩小导致许多产品的体积产热率和表面热通量增加。 除了美国的参与者外，预计欧洲和亚洲的国际参与者也将大量增加。 在选定的新兴领域邀请的会谈将补充贡献的文件。 小组讨论将侧重于技术和市场趋势，并确定研究挑战。 这些资金将帮助支持美国参与者的旅行，包括本科生和研究生，博士后研究员和研究资金有限的非终身教职员工。

AbstractTHERMES 2002 is a workshop/conference which will focus on the recent advances in thermal management and characterization schemes, as well as forecasts and analyses of future trends. It is to be held in Santa Fe, New Mexico, in early 2002. Thermal issues are key in electronic product development at all levels of the electronic product hierarchy, from the chip to the ultimate system. Shrinking system sizes are resulting in increasing volumetric heat generation rates and surface heat fluxes in many products. In addition to the U.S. participants, a significant international participation from Europe and Asia is expected. Invited talks in selected emerging areas will be complemented with contributed papers. Panel discussions focusing on technology and market trends and identification of research challenges will be included. The funds will help support travel for U.S. participants consisting of undergraduate and graduate students, post-doctoral fellows, and non-tenured faculty with limited research funding.