SBIR Phase I: Electron Beam Curing of Polymer Interlayer in Silicon Carbide Joints

这个名为“碳化硅接头中聚合物中间层的电子束固化”的小型企业创新研究第一阶段项目将开发这项技术，以实现碳化硅组件的经济商业化。目前的连接技术太耗时，不能经济地进行商业化和大规模生产，它们往往会产生过大的聚合物收缩，因此需要过多的聚合物渗透。建议的脉冲电子束固化技术将在微秒级完成聚合物的交联，从而消除这些障碍，这与电子束脉冲的持续时间相当。在这个第一阶段的工作中，首先将通过对夹层材料进行电子束辐照来研究聚合物收缩，并将得到的样品与传统方法处理的样品进行比较，即没有经过电子束处理的样品。然后是碳化硅接头的生产。这些用电子束固化产生的连接测试样品将再次与对照接头样品进行比较。这个项目的成功将为碳化硅部件在许多不同的工业和制造市场上的商业化铺平道路，包括石化、半导体、热处理和热交换系统、飞机和地面燃气轮机以及飞机结构部件。

This Small Business Innovation Research Phase I project entitled " Electron BeamCuring of Polymer Interlayer in Silicon Carbide Joints" will develop the technology toenable economical commercialization of silicon carbide components. Current joining techniques are too time consuming to be economically viable for commercialization and mass production They tend to produce excessive polymer shrinkage and thus require excessive number of polymer infiltrations. The proposed pulsed electron beam curing technology will remove these obstacles bycompleting the polymer cross-linking in the microsecond time scale, which is comparableto the duration of the electron beam pulse. In this Phase I effort, the polymer shrinkagein the interlayer material will be studied first by subjecting it to electron beam irradiation.The resulting samples will be compared to those processed under conventional method,i.e., without undergoing electron beam processing. This will then be followed by theproduction of SiC joints. These joined test samples, produced with electron beam curing,will again be compared to a control joint sample. Computer simulation code will be usedto guide the experiments.Success of this project will pave the way for commercializingSiC components in many different industrial and manufacturing markets, includingpetrochemical, semiconductor, heat-treating and heat-exchanger systems, aircraft andterrestrial gas turbines, and aircraft structural components.