SBIR Phase I: New Class of Ultra Low Dielectric Constant Polymers for Electronic Applications

这个小企业创新研究（SBIR）第一阶段项目提出开发一种基于聚亚苯基自增强聚合物（SRPs）的新型先进聚合物复合材料。 具有上级电、热和机械性能的聚合物对于各种先进的电子封装和片上应用至关重要。 已经提出了许多聚合物作为对这个问题的答案。 然而，目前所有的有机硅都有一个致命的缺陷：它们都具有促进高介电常数和高水分吸收的极性部分。为了克服这个问题，本项目将开发一种新型的可加工、高温、极低介电性、极低吸湿性和低成本的无极性基团的绝缘材料，用于各种电子封装和层间绝缘应用。本项目的商业应用是在电子和芯片型产品的广泛领域。低介电常数聚合物的缺乏限制了下一代电子器件的发展。 随着建筑尺寸的不断减小，现有材料无法满足对绝缘性能的需求，因此所提出的材料的出现将对行业产生重大影响。

This Small Business Innovation Research (SBIR) Phase I project proposes to develop a new class of advanced polymeric dielectrics based on polyphenylene Self-Reinforced Polymers (SRPs). Polymers with superior electrical, thermal and mechanical performance are critical for a variety of advanced electronics packaging and on-the-chip applications. A number of polymers have been proposed as an answer to this problem. All current organic dielectrics, however, have a fatal flaw: they all feature polar moieties that promote high dielectric constants and high moisture uptake. To overcome this problem this project will develop a new type of processable, high temperature, very low dielectric, very low moisture absorbing and low cost dielectrics containing no polar groups for usage in a wide variety of electronic packaging and interlayer dielectric applications.The commercial application of this project is in the broad area of electronic and on-the-chip type products. The absence of low dielectric constant polymers is limiting the development of the next generation of electronic devices. As architectures continue to decrease in size, demands for insulative properties cannot be met by existing materials and consequently emergence of the proposed material will have a significant impact on the industry.