Sensors: Adaptive Fiber Optic Sensor Networks for Monitoring Dynamic Strains

Sridhar Krishnaswami Northwester University将开发一种使用新的阵列解调方案来监测动态应变的自适应光纤传感器网络。与扫描解调方法不同的是，每个传感器都是按顺序探测的，所提出的方法将使所有光纤传感器始终处于活动状态。传感器网络还将自动适应低频传感器漂移，例如由缓慢的结构变形或温度变化引起的漂移，同时保持对动态应变的敏感性。因此，自适应光纤传感器网络可用于监控结构振动、冲击损伤、声发射或有意诱导的超声波信号。这种系统的应用包括结构健康监测、过程监测和结构的相控阵超声成像。该项目将包括传感器和系统的开发、建模以及在健康监测和过程监测中的应用。主要的应用重点将是使用超声波和声发射传感器进行结构健康监测。将探索的其他应用包括缺陷结构的光声成像，以及聚合物复合材料的过程监测，其中传感器在制造时嵌入结构中，并用于评估复合材料的固化状态。该项目将培训材料表征、光学和超声波等跨学科领域的学生。这是传感器倡议NSF04-522下的一个项目。

Abstract0427738 PI: Sridhar KrishnaswamyNorthwester Univ.An adaptive Fiber-Optic Sensor network to monitor dynamic strains using a novel array demodulation scheme will be developed. Unlike scanned-demodulation approaches where each sensor is probed sequentially, the proposed approach will enable all the fiber sensors to be active at all times. The sensor network will also automatically adapt to low-frequency sensor drift such as those induced by slow structural deformation or temperature changes, while retaining sensitivity to dynamic strains. The adaptive fiber-optic sensor network can therefore be used to monitor structural vibration, impact damage, acoustic emissions, or intentionally-induced ultrasonic signals. Applications of such a system include structural health monitoring, process monitoring, and phased-array ultrasonic imaging of structures. The project will include sensor and system development, modeling, and applications to SHM and process monitoring. The primary application focus will be structural health monitoring using ultrasonic and acoustic emission sensors. Other applications that will be explored include photo-acoustic imaging of structures for flaws, and process monitoring of polymer composites where the sensors are embedded into the structure at the time of manufacturing and are used to assess the cure state of the composite. The project will train students in the cross-disciplinary fields of materials characterization, optics, and ultrasonics.This is a project under Sensors Initiative NSF04-522.