STTR Phase I: E-Beam Automated Tape Placement Technology for High Temperature Composites

这个小型企业技术转让第一阶段项目的重点是高温树脂和胶带的开发及其在自动胶带放置（ATP）制造中的应用。热塑性聚合物基体ATP和逐层电子束固化ATP（EB-ATP）已被确定为实现ATP复合材料的高压釜性能的最有前途的技术之一。在该计划过程中开发的材料是完全酰亚胺化的聚酰亚胺模塑粉末，具有低熔体粘度和适合高温应用的固化性能。除了材料本身之外，还将在该计划的过程中开发制造高质量带材和制造复合板的工艺。制造商的可负担性已经对先进复合材料结构部件中热稳定聚合物的益处的商业开发提出了重大障碍。在第一阶段计划及其第二阶段后续计划中开发的高温、低熔体粘度聚酰亚胺与粉末丝束预浸料和胶带的拟议组合将成为一种使能技术，用于扩展纤维缠绕和ATP与电子束固化的使用，用于高性能复合材料，并将填补先进复合材料行业急需的利基市场。

This Small Business Technology Transfer Phase I project focuses on the development of high temperature resins and tapes and their use in automated tape placement (ATP) fabrication with in-situ electron beam cure. Thermoplastic polymer matrix ATP and layer-by-layer electron beam curing ATP (EB-ATP) have been identified as among the most promising techniques for achieving autoclave properties in ATP composites. The materials to be developed during the course of this program are fully imidized polyimide molding powders with low melt viscosity and cured properties suitable for high-temperature applications. In addition to the materials themselves, processes for fabricating high quality tapes and for manufacturing composite plates will be developed during the course of this program. Manufacturing affordability has presented a significant barrier to the commercial exploitation of the benefits of thermally stable polymers in advanced composite structural components. The proposed combination of high temperature, low melt viscosity polyimide with powder towpreg and tape developed during this Phase I program and its Phase II follow-on will be an enabling technology for extending the use of filament winding and ATP with electron beam cure for high-performance composites and will fill a much-needed niche in the advanced composites industry.