STTR Phase II: Development of Nanostructured Solder Materials

该小企业技术转让（STTR）第二阶段项目将开发纳米结构增强材料，以提高锡基电子焊料合金的热机械疲劳（Thermo-Mechanical Fatigue，简称TMF）性能和服务可靠性。焊点的服务可靠性将在第二阶段通过在模拟的实际服务条件下同时施加外部电、热和机械偏移来研究。为了开发商业上可行的产品，第二阶段将与焊料供应商和最终用户合作，解决制造不同形式的纳米结构焊料材料的规模扩大问题，以及与在不同焊接方法下制造电子元件时使用该产品相关的处理和处置问题。尝试采用无铅焊料的结果突出了几个采用问题和对用无铅焊料组合物制成的互连的服务可靠性的关注。在第一阶段，结合表面活性和热稳定的纳米结构颗粒作为晶界增强材料，以显着提高机械和服务性能和接头的可靠性，一般的可行性得到了证明。这一基本发现大大增强了对影响焊点高温使用性能和可靠性的整体工艺的理解。拟议的第二阶段项目将开发纳米结构焊接材料扩大生产所需的知识库，并获得在电子元件制造中实施纳米结构焊接材料所需的技术数据库。焊料纳米增强的验证预计将在各种结构材料中产生重大的商业影响。拟议的项目代表了获得与传统铅锡共晶焊料性能相当的环保焊料材料的一个很好的步骤，这可能导致数十亿美元的全球焊料市场的重大销售。

This Small Business Technology Transfer (STTR) Phase II project will develop nanostructured reinforcements to improve the thermo-mechanical fatigue (TMF) performance and service reliability of tin-based electronic solder alloys. Service reliability of solder joints will be studied under Phase II by simultaneously imposing external electrical, thermal and mechanical excursions under simulated realistic service conditions. Toward developing commercially viable products, Phase II will address scale-up issues in manufacturing different forms of nanostructured solder materials, as well as processing and disposal issues associated with the use of this product in fabrication of electronic components under different soldering methodologies, and in collaboration with solder suppliers and end users. A result of attempted adoption of lead-free solders has highlighted several adoption issues and concerns over service reliability of interconnects made with lead-free solder compositions. In Phase I, the general viability of incorporating surface active, and thermally stable nanostructured particulates as grain boundary reinforcements to significantly enhance mechanical and service performance and reliability of joints, was demonstrated. This fundamental discovery has significantly enhanced the understanding of the overall processes that affect the high temperature service performance and reliability of the solder joints. The proposed Phase II project will develop the knowledge base required for scale-up production of nanostructured solder materials and to obtain the technical data base necessary for implementation of the same in the manufacture of electronic components.The validation of nano-reinforcement of solders is expected to have significant commercial implications in a wide variety of structural materials. The proposed project represents an excellent step towards obtaining environmentally-benign solder materials with equivalent performance to traditional lead-tin, eutectic solders and which could lead to significant sales in the multi-billion dollar worldwide solder market.