Numerical and Experimental Analysis of Earth-Based Structural Materials

夯实土和稳定泥块是由土壤，水和少量水泥压实混合制成的材料，用作建筑物的结构材料。当夯实的土被压实在适当的位置时，泥块被用机械压力机压实成砖。虽然类似的材料已经使用了数千年，但从现代工程的角度来看，它们的结构特性还没有得到很好的理解。根据这一建议，将使用称为有限元法的计算机建模技术分析材料。这种计算机模型可以分析墙壁在不同条件下的行为，包括改变垂直重量和更多的水平力，如地震。计算机模型将得到加强，以预测通过这些结构的砖和砂浆的扩展裂缝。分析的重点将是建筑物如何对水平力作出反应。这项分析将与印度科学研究所在班加罗尔进行的墙壁实验建模合作进行。建模将用于用这些材料建造更安全、更经济的建筑。这些材料在印度和其他一些国家广泛使用，因为它们经济实惠，结构合理，耐用。他们也看到了更广泛的兴趣，在发达国家，因为他们有许多优势，环境，节省能源，无论是在建设和建筑？的一生。开发的计算机技术也将适用于许多其他材料，特别是那些可能在现有的弱界面上或通过身体破裂的材料，如电子半导体上的薄膜。最后，调查将加强与班加罗尔小组的国际研究合作。

Rammed earth and stabilized mud block are materials made from a compacted mix of soil, water, and a small amount of cement, used as structural materials in buildings. While rammed earth is compacted in place, mud block is compacted into a brick using a mechanical press. While similar materials have been used for millenia, from a modern engineering standpoint, their structural properties are not well understood. Under this proposal, the materials will be analyzed using a computer modeling technique known as the finite element method. Such computer models can analyze the behavior of the walls under different conditions, including changing vertical weights and more horizontal forces such as earthquakes. The computer models will be enhanced to predict the propagation fractures through the brick and mortar of these structures. The focus of the analysis will be on how the buildings respond to horizontal forces. This analysis will be conducted in collaboration with experimental modeling of walls conducted at the Indian Institute of Science, Bangalore.The modeling will be used to create safer and more economical buildings out of these materials. These materials are used widely in India and a few other countries as they are economical and, properly constructed, durable. They are also seeing wider interest in the developed world as they have many advantages environmentally, saving energy both in construction and over a building?s lifetime. The computer techniques developed will also be applicable to many other materials, especially those that may fracture on existing weak interfaces or through the body, such as thin films on electronic semiconductors. Finally, the investigation will strengthen international research collaborations with the group in Bangalore.