BRIGE: Research and Education on Mechanical Behavior of Wafer-Level Films in Integrated Systems

这扩大参与研究启动赠款工程（BRIGE）赠款提供资金，以调查与薄膜破裂在回流过程中的微系统的基本力学问题。微纳电子系统的三维集成需要晶圆级制造工艺的创新。晶圆级薄膜叠层技术的发展是进一步实现功能集成和降低功耗的关键。将建立一个包括新理论发展和数值实现的多物理方法来研究集成系统中圆片级薄膜的力学行为。将开发多尺度分析，以分别了解纳米、微米和宏观尺度的失效过程。 实验将生成原位水分增重、湿度敏感性和回流的数据。将制造和测试专门设计的小规模组件。试验数据将用于验证理论预测和数值模拟结果。如果成功的话，这项研究的结果将直接有利于三维微纳电子封装和系统集成的技术发展，提供了一个最佳的制造工艺窗口。研究结果将有助于新的晶圆级薄膜材料的设计提供一个最佳的设计协议。从这项调查中获得的知识将避免“试错”实验，并将有助于使新的过程开发和系统级集成成为现实。这项研究将通过成果的传播使学术界、半导体行业和公众受益。将纳入一项教育计划，以扩大工程研究人员的参与，包括来自工程学科代表性不足的群体和残疾人的成员。该教育计划还包括推广计划，将促进少数民族本科生的科学，技术，工程和数学（STEM）职业，并将激发兴趣，促进K-12学生未来的工程职业选择。

This Broadening Participation Research Initiation Grants in Engineering (BRIGE) grant provides funding to investigate the fundamental mechanics issues associated with thin film rupture at reflow process in microsystems. The three-dimensional integration of micro- and nano- electronics systems require innovations of manufacturing processes at the wafer level. The development of wafer-level thin film lamination is critical for the success in further function integration and lower power consumption. A multi-physics approach, which includes new theory development and numerical implementation, will be established to investigate the mechanical behavior of wafer-level films in integrated systems. Multi-scale analysis will be developed to understand the failure processes at the nano-, micro-, and macro-scales, respectively. Experiments will generate data for in-situ moisture weight gain, moisture sensitivity, and reflow. Specially designed small-scale assemblies will be fabricated and tested. The test data will be used to validate the theoretical predictions and numerical simulation results. If successful, the results of this research will directly benefit the technology development of three-dimensional micro- and nano- electronics packaging and system integration by providing an optimal manufacturing processing window. The research outcome will assist in the design of new wafer-level film materials by providing an optimal design protocol. Knowledge gained from this investigation will avoid "trial-and-error" experiments, and will contribute to making new process development and system-level integration a reality. This research will benefit the academic community, semiconductor industry, and general public through the dissemination of results. An education plan will be integrated to broaden the participation of engineering researchers including members from underrepresented groups and persons with disabilities in the engineering disciplines. The education plan also includes outreach programs that will promote science, technology, engineering and mathematics (STEM) careers of minority undergraduate students, and will stimulate interest and promote future career choices in engineering for K-12 students.