SBIR Phase I: RF MEMS Relay for ATE Applications

这个小企业创新研究（SBIR）第一阶段项目将开发用于自动化测试设备（ATE）、无线前端和其他商业应用的RF MEMS（射频微机电系统）继电器。随着微芯片技术的不断进步，微芯片的测试和鉴定变得越来越具有挑战性和昂贵。RF MEMS可以在主流半导体制造中实现更低的成本，更高的吞吐量和更可重复的测试和认证。特别是，RF MEMS继电器可以为具有通晶圆通孔的下一代3D芯片的探测提供好处，这些芯片需要敏感且非常快速的测试能力。拟议的项目解决了生产的可制造性和包装挑战。与许多RF MEMS技术使用的精品制造工艺相比，拟议的项目利用了成熟且强大的硅MEMS生产工艺和基础设施。此外，封装采用晶圆级密封封装，解决了RF MEMS器件密封的高成本问题。ATE应用代表了所提出的RF MEMS继电器技术的初始应用。随着产量的增加，无线应用以及其他应用可以通过更低的价格实现。预期结果包括RF MEMS继电器技术，具有低成本集成封装，准备好并符合生产条件。该项目更广泛的影响/商业潜力包括ATE、无线和为科学界提供射频功能。RF MEMS可能在测试下一代微芯片方面提供ATE关键优势，包括与传统机械继电器相比提高了可重复性和可靠性。RF MEMS对于测试需要灵敏和高通量测试的下一代3D微芯片至关重要。对于无线，射频MEMS地址重新配置和调谐，以提高功率效率和无线电的链路鲁棒性。例如，RF MEMS可用于(1)将可重构天线从高带宽视距配置更改为低带宽分集配置，或(2)补偿无线手机？S功率放大器使其在不断变化的工作环境中保持最大效率（包括与基站的阻抗和距离）。对于科学应用，RF MEMS继电器提供低插入损耗和优越的线性从直流到100 GHz。与半导体晶体管相比，RF MEMS的插入损耗降低了大约10倍。因此，各种无线电架构以及用于监测天气和气候的辐射计都可能受益。预期结果包括RF MEMS技术，具有低成本集成封装，准备好并符合生产条件。

This Small Business Innovation Research (SBIR) Phase I project will develop RF MEMS (Radio Frequency Microelectromechanical Systems) relays for automated test equipment (ATE), wireless frontends, and other commercial applications. As the advancement of microchip technology continues, the testing and qualification of microchips become more challenging and costly. RF MEMS may enable lower cost, higher throughput and more repeatable test and qualification in mainstream semiconductor manufacturing. In particular, RF MEMS relays may offer benefits for probing of next generation 3D chips with thru-wafer vias that require sensitive and yet very rapid test capabilities. The proposed project addresses the manufacturability and packaging challenges for production. In comparison to boutique manufacturing processes utilized by many RF MEMS technologies, the proposed project leverages the proven and robust silicon MEMS production processes and infrastructure. Furthermore, packaging is performed using wafer-level hermetic packaging that addresses the high cost of hermetic sealing for RF MEMS devices. ATE applications represent the initial application of the proposed RF MEMS relay technology. Wireless applications, as well as other applications, can be enabled by lower prices as production volumes are ramped up. Anticipated results include a RF MEMS relay technology, with low-cost integrated packaging, ready and qualified for production.The broader impact/commercial potential of this project includes ATE, wireless, and enabling RF capabilities for the scientific community. RF MEMS may offer ATE key advantages in testing next generation microchips, including improved repeatability and reliability compared to conventional mechanical relays. RF MEMS may be critical for testing next generation 3D microchips with thru-wafer-vias that require sensitive and yet high-throughput testing. For wireless, RF MEMS address reconfiguration and tuning for improved power efficiency and link robustness of radios. For example, RF MEMS may be utilized for (1) changing a reconfigurable antenna from a high bandwidth line-of-sight configuration to a lower bandwidth diversity configuration, or (2) compensating a wireless handset?s power amplifier for its changing operating environment to maintain maximum efficiency (including impedance and distance from the base station). For scientific applications, RF MEMS relays offer low insertion loss and superior linearity from DC to 100 GHz. In comparison to semiconductor transistors, RF MEMS have an approximate 10x reduction in insertion loss. Thus, a variety of radio architectures may benefit, as well as radiometers for monitoring weather and climate. Anticipated results include a RF MEMS technology, with low cost integrated packaging, ready and qualified for production.