STTR Phase I: Sub-circuit Energy Monitoring and Performance ReAction Software (SEMPRA Software)

这个项目更广泛的影响/商业潜力集中在提高计算机功率利用率上，即使晶体管的尺寸继续缩小。现代计算设备的能量密度要求比以往任何时候都高，导致移动设备的严格功率限制，固定基础设施计算的高运营成本，以及最高密度微芯片的低产量。移动设备制造商在电池寿命方面展开了激烈竞争。云服务提供商消耗并支付的能源相当于小城市的能源。与此同时，美国制造商的竞争力也岌岌可危。本项目将在微芯片、电子设备和利用它们的智能电源需求响应管理系统的能源和电源管理方面产生广泛的影响，通过提高IC性能而不增加功率。打开了计算机电力利用新时代的大门。这个小型企业技术转移（STTR）第一期项目扩展了集成芯片的原位功率测量和电源管理的工业和学术研究。在很大程度上，到目前为止，工业和学术研究已经产生了一个惊人的缺乏实际的解决方案的原位功率测量。然而，这个项目是建立在先前nsf资助的研究的基础上的，这些研究指向了新颖的实际应用。通过消除工业级测试平台中的重大技术风险，该STTR项目将展示这些应用之一的可行性，该应用将提供精确的子组件级功率和温度监测，全封装芯片上的运行时热点检测，以及基于精确功率/温度测量的智能电源管理。在这个项目完成之前，没有人可以预测是否有可能以足够低的管理费用来证明商业采用的合理性。

The broader impact/commercial potential of this project centers on increasing the efficiency of computer power utilization even as transistors continue to shrink in size. The energy density requirements of modern computing devices are higher than ever before, leading to strict power constraints in mobile devices, high operating costs for fixed infrastructure computing, and incredibly low yields for the highest-density microchips. Mobile device manufacturers fiercely compete on battery life. Cloud service providers consume, and pay for, the energy equivalent of small cities. Meanwhile, the competitiveness of American manufacturers hangs in the balance. The present project will have wide ranging impacts in Energy and Power Management in microchips, electronic devices, and smart power demand-response management systems that utilize them, by increasing IC performance without increasing power ? opening the door to a new era of computer power utilization. This Small Business Technology Transfer (STTR) Phase I project expands upon both industry and academic research concerning in-situ power measurement and power management of integrated chips. For the most part, to date both industry and academic research has produced a striking paucity of practical solutions for in-situ power measurement. This project, however, builds upon prior NSF-funded research which has pointed toward novel practical applications. By removing significant technical risks in an industry-class testbed, this STTR project will demonstrate the viability of one of these applications, which will provide accurate sub-component level power and temperature monitoring, run-time hotspot detection on a fully packaged chip, and intelligent power management based on accurate power/temperature measurements. Until this is project is complete, no one can predict whether it is possible to operate with overheads that are low enough to justify commercial adoption.