NSF Student Travel Grant for the 25th International Meshing Roundtable

该项目支持学生参与将于2016年9月27-30日在华盛顿举行的第25届国际啮合圆桌会议。网格化是将复杂对象分解成简单的部分，用于设计、显示和分析。随着计算、计算机辅助设计和制造技术的变化，对啮合的需求似乎只会增加。IMR会议包括四个短期课程，四个特邀演讲者，以及评论论文、研究笔记和海报的陈述，以及一个专门针对学生和博士后的专业发展会议。该奖项将资助十几名学生(从本科生到博士后，来自美国大学、国家实验室或非营利性研究组织)与来自世界各地的专家交流想法，促进合作和认可，帮助他们开始职业生涯。(有关遴选标准，请参阅会议网站http://www.imr.sandia.gov/25imr)

This project supports student participation in the 25th International Meshing Roundtable conference will be held on September 27-30, 2016 in Washington DC. Meshing is the decomposition of complex objects into simple parts for design, display, and analysis. As technologies change in computing and computer-aided design and manufacturing the demand for meshing seems only to increase. The IMR conference includes four short courses, four invited speakers, and presentations of reviewed papers, research notes, and posters, and a professional development session particularly targeting students and postdocs. This award will support registration and some travel expenses for a dozen students (undergraduate to postdoctoral, coming from U.S. universities, national labs, or non-profit research organizations) to exchange ideas with experts from around the world, fostering collaboration and recognition that can help them launch their careers. (For selection criteria, see the conference web site http://www.imr.sandia.gov/25imr)