SBIR Phase I: The Next Generation of High-Speed Dielectric Materials

这个小企业创新研究（SBIR）第一阶段项目的更广泛/商业影响集中在开发用于印刷电路板（pcb）的高速，高性能绝缘体平台，这将显着提高网络，通信和计算的性能。虽然PCB制造取得了重大进展，但二十年来一直缺乏绝缘体技术的创新。这一差距导致了信号完整性、数据速率、效率、发热、外形尺寸和成本等方面的性能不理想。这种限制可以通过用非增强的低损耗材料代替纤维增强层压板来克服。通过开发一种新型绝缘材料，该项目将实现更快的处理速度和更高的数据速率，以促进下一代电子产品的发展。该项目旨在与美国的PCB制造商合作，以消除供应链瓶颈和岸上制造工作的风险。这个小企业创新研究第一阶段项目旨在开发新的合成聚合物替代品，以替代目前用于印刷电路板（pcb）的纤维增强材料，这些材料具有低介电常数（Dk）和低耗散因子（DF），无斜。pcb对于所有电子产品都是至关重要的，但由于传统使用的纤维增强层压板材料的各向异性，导致了高信号损耗。随着对更高数据速率需求的增加，需要无斜、超低损耗和低Dk材料。目前的介电材料具有不均匀的介电特性，因此传输线遇到不同的有效Dk，导致歪斜和限制数据速率。通过开发合成聚合物薄膜作为传统PCB介电材料的替代品，该团队的目标是开发低Dk（≤2.8）和低DF（≤0.0026）的材料，这些材料本质上是无偏斜和低损耗的。新型热固性聚合物配方必须开发和表征。然后，可以通过试点制造来成功评估具有有利于多氯联苯特性的材料，以确定它们在大规模制造环境中的可行性。最后，这些低Dk，低DF材料可用于创建原型PCB，以在生成高密度互连型应用所需的更复杂的PCB结构之前评估其可靠性。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase I project centers on developing a high-speed, high-performance insulator platform for Printed Circuit Boards (PCBs) that will significantly enhance performance in networking, communications, and computing. While PCB manufacturing has seen significant advances, innovation in insulator technology has been lacking for two decades. This gap has led to suboptimal performance in signal integrity, data rates, efficiency, heat generation, form factor, and cost. Such limitations can be overcome by replacing fiber-reinforced laminates with non-reinforced, low loss materials. By developing a novel class of insulating materials, the project will enable faster processing speeds and higher data rates to facilitate the development of next generation electronics. This project aims to work with US-based PCB manufacturers to de-risk supply chain bottlenecks and on-shore manufacturing jobs.This Small Business Innovation Research Phase I project aims to develop novel, synthetic polymer alternatives to current fiber-reinforced materials for printed circuit boards (PCBs) that are skew-free with a low dielectric constant (Dk) and low dissipation factor (DF). PCBs are paramount for all electronics but result in high signal loss due to the anisotropy of the fiber-reinforced laminate materials traditionally used. As demand for higher data rate rises, skew-free, ultra-low loss, and low Dk materials are needed. Current dielectric materials have non-uniform dielectric properties, so transmission lines encounter a different effective Dk, causing skew and limiting data rates. By developing synthetic polymer films as an alternative to traditional PCB dielectric materials, the team aims to develop low Dk (≤ 2.8) and low DF (≤ 0.0026) materials that are inherently skew-free and low loss. Novel thermosetting polymer formulations must be developed and characterized. Successful evaluation of materials with properties conducive to PCBs can then be taken through pilot manufacturing to determine their viability in large-scale manufacturing environments. Finally, these low Dk, low DF materials can be used to create prototype PCBs to evaluate their reliability before generating more complex PCB structures required for high-density-interconnect-type applications.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.