Diffusion Bonding of High Temperature Ceramic Superconductor

用扫描电子显微镜/电子探针分析、差热分析、X射线衍射测试和超导性能检测等手段，研究了以氧化银为中间层的Y-Ba-Cu-O系高温超导体的扩散结合能力。差热分析结果表明，添加到超导体中的氧化银在350℃左右分解。在接头附近的X射线衍射测试结果表明，氧化银为接头区域提供了氧气，并有助于维持接头的超导电性。X射线衍射结果还表明，结合区被破坏的超导层厚度离结合界面不到0.3 mm。这些结果表明，通过分解和扩散中间层材料到基材中，可以在不损害超导电性的情况下实现高T_c陶瓷超导体的扩散连接。

Diffusion bond-ability of Y-Ba-Cu-O system high Tc superconductor using silver oxide as an interlayr material has been investigated by SEM/EPMA analysis, differential thermal analysis, X-ray diffraction tests and examination on superconducting behavior of the joints. Differential thermal analysis results showed that silver oxide added to the superconductor decomposed at about 350C.X-ray diffraction test results in the vicinity of the joints suggested that the silver oxide supplies oxygen to the joint area and contributes to maintain the superconductivity of the joint. X-ray diffraction results also showed that the thickness of the destroyed superconductive layr at the joint area was less than 0.3 mm from the bonded interface. These results demonstrate the possibility of diffusion bonding of high Tc ceramic superconductor without impairing the superconductivity by decompoising and diffusing the interlayr material into the base material.