Studies in PTLP Bonding of Ceramics

采用自行设计的镍基过渡层，在1150ﾟC下实现了Al_2O_3的部分瞬间液相连接。在1150ﾟC下，用座滴法研究了添加剂(铬、镍和80Ni.20Cr)对液态铜在Al_2O_3上润湿特性的影响。Ni和80Ni.20Cr芯层在液态铜层中部分溶解，液态铜向镍层和80Ni.20Cr芯层中扩散。(2)铜/80Ni.20Cr/铜中间层平均强度最高，标准差最小。平均四点弯曲强度为251 Mpa，标准差为&lt；正负&gt；29 Mpa，断裂主要发生在陶瓷上。(3)Ni的加入对降低液态铜在Al_2O_3基片上的接触角没有影响。在Al_2O_3基片上单独添加80Ni.20Cr或Cr，均可降低液态铜的接触角。(4)研究结果表明，在粘接温度范围内，铬在液态铜膜中的溶解改善了液态铜膜在Al_2O_3表面的润湿性，有利于形成牢固可靠的PTLP连接Al_2O_3接头。

Through the use of microdesigned Ni-based interlayrs, PTLP (Partial Transient-Liquid Phase) bonding of alumina has been achieved at 1150ﾟC.The effect of additions (Cr, Ni and 80Ni.20Cr) on the wetting characteristics of liquid Cu on Al_2O_3 has been studied using a sessile drop method at 1150ﾟC.The key conclusions are as follows :(1)At the bonding temperature, some dissolution of Ni and 80Ni.20Cr core layrs into liquid Cu film and the diffusion of liquid Cu into Ni and 80Ni.20Cr core layr occurred.(2)The highest average strength and smallest standard deviation were achieved using Cu/80Ni.20Cr/Cu interlayr. The average four-point flexure strength was 251 MPa and a standard deviation of <plus-minus>29 MPa, and failure proceeded primarily in the ceramic(3)Ni additions have no effect on reducing the contact angle of liquid Cu on an Al_2O_3 substrate. Additions of 80Ni.20Cr or Cr alone reduce the contact angle of liquid Cu on an Al_2O_3 substrate. The contact angle reduction depends upon the Cr content of the sessile drop and anneal time.(4)The results demonstrate that as the bonding temperature, the dissolution of Cr into liquid Cu film improved the wettability of liquid Cu film on Al_2O_3 and facilitate the formation of reliably strong joint of PTLP bonded Al_2O_3 using Cu/80Ni.20Cr/Cu interlayr.