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Higher, more precise, multifunctional - From micro- to mesoscale structures through 'next-level laser lithography' as the core building block of a high-performance process technology (mesoTrace)

Higher, more precise, multifunctional - From micro- to mesoscale structures through 'next-level laser lithography' as the core building block of a high-performance process technology (mesoTrace)
更高、更精确、多功能 - 通过“下一代激光光刻”从微米到介观结构,作为高性能工艺技术的核心构建模块 (mesoTrace)
批准号:
497866273
负责人:
金额:
$0.0万
依托单位:
依托单位国家:
德国
项目类别:
Major Instrumentation Initiatives
财政年份:
--
资助国家:
德国
项目状态:
未结题
起止时间:

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中文摘要
翻译
光刻制造具有从几十微米到几百微米尺寸的轮廓高度的功能结构的可能性目前非常有限,其同时满足非常高的精度要求并在大的横向范围上延伸。这些结构解决了微观和中尺度之间的过渡,提供了非常高的潜力,特别是在光学和半导体技术中,以提供以前无法或仅无法充分实现的特性。光学的例子有:(i)同时利用高和低衍射级的衍射结构,(ii)在自由形式的弯曲折射表面上的衍射结构的混合元件,或(iii)具有统计或周期性分布和变化的透镜几何形状的深的、定制的微透镜阵列。在半导体技术中,介观尺度掩模结构可以用于例如掺杂功率半导体器件,这对于可再生能源领域中的有效能量转换是必要的。该项目的目标是在从微观到中尺度的过渡范围内大大超过功能结构可制造性的先前限制,并从根本上探索可用的技术。该项目的主要目标是获得最先进的直写激光光刻系统。该项目主要遵循三个科学方面:A)克服激光光刻以前的局限性。这涉及到可实现的轮廓高度显著增加到180 µm的范围内,减少了干扰“缝合”效应以及在扩展区域上减少了表面粗糙度。B)激光光刻与随后的等离子体蚀刻工艺的组合:研究了通过干法蚀刻工艺用于深且高精度的光致抗蚀剂结构的结构转移的限制。C)精心制作的“中尺度”结构的性质和功能。最后,新的可用结构将用于正在进行的科学项目,特别是用于高光谱和多模态光学仪器以及离子辐照半导体器件。该团队由四个合作伙伴组成,他们的能力可以很好地相互补充:布伦纳教授,吕布和席(EAH-Jena)联合收割机在纳米制造方面的相关经验,和微结构以及它们在多模态光学系统以及半导体制造中的用途。H博士教授的能力概况。Hillmer(卡塞尔大学)为微米和纳米技术以及光谱传感应用的微光学结构研究提供了出色的协同作用。
英文摘要
The possibilities for the lithographic fabrication of functional structures with profile heights in the dimensions from a few tens to several hundred micrometers, which simultaneously meet very high accuracy requirements and extend over large lateral ranges, are currently very limited. These structures, which address the transition between the micro- and the mesoscale, offer a very high potential, especially in optics and semiconductor technology, to provide properties that were previously not or only insufficiently attainable. Examples from optics are: (i) diffractive structures simultaneously utilizing high and low diffraction orders, (ii) hybrid elements of diffractive structures on free-form curved refractive surfaces, or (iii) deep, tailored microlens arrays with statistical or periodic distribution and varying lens geometry. In semiconductor technology, mesoscale mask structures can be used e.g. for doping power semiconductor devices that are necessary for efficient energy conversion in the field of renewable energies. This project aims to significantly exceed previous limits in the manufacturability of functional structures in the transition range from the micro- to the mesoscale and to fundamentally explore the usable technologies. The primary objective of the project is the acquisition of a state-of-the-art direct-writing laser lithography system.The project mainly follows three scientific aspects: A) Overcome previous limitations of laser lithography. This concerns the considerable increase of achievable profile heights into the range up to 180 µm, a reduction of disturbing 'stitching' effects as well as the reduction of surface roughness, over extended areas. B) Combination of laser lithography with subsequent plasma etching processes: The limits of the structure transfer for deep and highly precise photoresist structures by dry etching processes are investigated. C) Properties and functionalities of the elaborated 'mesoscale' structures. Finally, the newly available structures will be used for ongoing scientific projects, in particular for hyperspectral and multimodal optical instrumentation and for ion-irradiated semiconductor devices.The team consists of four partners whose competences complement each other excellently: Professors Brunner, Rüb and Schie (EAH-Jena) combine relevant experience in the fabrication of nano- and microstructures and their use in multimodal optical systems as well as in semiconductor manufacturing. The competence profile of Prof. Dr. H. Hillmer (University of Kassel) offers excellent synergies to micro- and nanotechnology as well as to the research of micro-optical structures for spectral sensing applications.
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