Direct Writer for MicroNano-Structuring

在微技术中，基于掩模的平版印刷和直接书写的平版印刷是有区别的。通过直接写入图案化工艺，微结构在UV光调制器的帮助下直接投影到实际基板的抗蚀剂层上，或者在矢量/光栅模式工艺中使用UV激光束“写入”。特别是在研究环境中，无掩模模式节省了时间、金钱和精力。此外，直接写入模式工艺可用于更灵活地响应不断变化的微观结构要求。申请人微技术研究所（IMT）迄今为止专门使用了基于掩模的结构过程。用于光刻掩模生产的掩模书写器和用于基板曝光的掩模校准器目前可用于此目的。面具作家是在2002年购买的，因此不再符合目前的艺术水平。这主要涉及最小可能的图案宽度或分辨率（800 nm），其次是光刻掩模完全曝光所需的时间（8至16小时）。原则上，掩码写入器也可以用于直接写入模式。然而，从曝光时间来看，这几乎是不现实的。由于不能产生明显小于1µm的结构，因此不使用该方法。为了使结构过程达到最好的技术水平，从而使IMT的研究比已经在工业使用的传统过程具有优势，将采购一种新的结构系统。它旨在将最小结构宽度减半，并将处理基板所需的时间减少到研究中可接受的水平。结构系统在使用中应该非常灵活，这只有通过直接写入过程才能实现。此外，与现有的所谓灰度曝光设备相比，它应该有一个新的功能，由于额外的深度信息，创新的3D结构是可能的。光刻结构几乎应用于IMT的每一个研究项目。有了新的直接写入器，更多的微/纳米结构变化将成为可能。这使得人们期望能够为现有的研究任务制定出全新的解决方案，并为未来的研究方法开发出新的思路。因此，IMT可以清楚地将自己与其他类似技术方向的研究机构区分开来。以这种方式实现的创新研究方法可以更显著地发表，并且更有吸引力转移给未来的用户，例如工业用户。

In microtechnology, a distinction is made between mask-based and direct-writing lithographic patterning processes. With a direct-writing patterning process, the microstructure is projected directly onto the resist layer of the actual substrate with the aid of a UV light modulator or "written" with the UV laser beam in the vector/raster mode process. Especially in the research environment, maskless patterning saves time, money and energy. In addition, a direct-writing patterning process can be used to respond much more flexibly to changing microstructure requirements. The applicant Institute of Microtechnology (IMT) has so far exclusively used the mask-based structuring process. A mask writer for the production of the lithography masks and a mask aligner for the substrate exposure are currently available for this purpose. The mask writer was purchased in 2002 and therefore no longer corresponds to the current state of the art. This primarily concerns the minimum possible pattern width or resolution (800 nm) and secondarily the time required for complete exposure of a lithography mask (8 to 16 hours). In principle, the mask writer can also be used in direct-writing mode. However, with the exposure times mentioned, this is hardly practical. It is also not used because no structures significantly smaller than 1 µm can be generated. In order to bring the structuring process up to the best possible technological level and thus give research at the IMT an edge over conventional processes already in industrial use, a new structuring system is to be procured. It is intended to halve the minimum structure widths and reduce the time required to process a substrate to a level acceptable in research. The structuring system should be very flexible in use, which is only possible with a direct-writing process. In addition, it should have a new function compared to the existing equipment with the so-called gray scale exposure, with which an innovative 3D structuring is possible due to the additional depth information. Lithographic structuring is used in almost every research project worked on at the IMT. With the new direct writer, many more variations of micro/nanostructuring will be possible. This leads to the expectation that completely new solutions for existing research tasks can be worked out and new ideas for future research approaches can be developed. The IMT could thus clearly distinguish itself from research institutions with an otherwise similar technological orientation. Innovative research approaches made possible in this way can be published more prominently and are more attractive for transfer to future, e.g. industrial, users.