Development of Directionally Aligned SiC Whisker Grinding Wheel

制备了定向排列SiC晶须砂轮，并对其磨削特性进行了测试。对树脂类砂轮、陶瓷类砂轮、金属类砂轮和玻璃类砂轮的磨削性能进行了测试，结果表明树脂类砂轮的表面光洁度最好。接下来，作者成功地开发了一种自由晶粒与磨削液混合的加载自由磨削方法，克服了SiC晶须砂轮的弱点。将这些砂轮应用于淬硬模钢和硅片的研磨加工，得到了非常光滑的表面。在此基础上，对树脂轮切削过程中的刀具磨损进行了研究。研究结果明确了晶须尺寸、形状和取向对刀具磨损的影响，提出了刀具疲劳磨损机理的新模型。

Grinding wheel made of the directionally aligned SiC whiskers was produced and its grinding characteristics were examined.Grinding characteristics of the resinoid, vitrified, metal and glass bonded wheels were tested and it was clarified that the resinoid wheel showed the best performance in the surface finish. Next, the authors succeeded in developing a loading free-grinding method in which free grains were mixed with grinding fluid, and overcoming a weak point of SiC whisker wheel. Futhermore, these wheel was applied to the lapping process, and very smooth surfaces of the hardened die steel and Si wafer were obtained.In addition to these experiments, tool wear were investigated in cutting the resinoid wheel. As the results, the effect of whisker size, shape and orientation on the tool wear were made clear and new model of wear mechanism due to fatigue was proposed.