P3EP UK Supply Chain Project

P3EP项目为采用氮化镓(GaN)器件的印刷电路板嵌入式电源系统开发了一条英国供应链。P3EP供应链将允许PEMD制造商制造功率密度最高的转换器，它将允许英国电力半导体公司进入这些市场。GaN等宽带隙功率器件提供极高的开关速度，并有可能大幅缩小系统尺寸。但这只能通过新的封装和模块构造方法来开发，这些方法可以增加热传递并减少寄生效应。将功率器件嵌入印刷电路板的新兴技术已被证明是实现这一目标的最先进的方法。P3EP在英国开发了完整的供应链。P3EP制造链基于GaN预封装。预封装与裸模相比具有重大优势，因为它们允许进行生产测试、表征和可靠性鉴定。这提高了PEMD系统的产量、成本和上市时间。此外，预封装使用的材料与芯片的兼容性优化，并可大大简化嵌入系统--印刷电路板。P3EP供应链包括：·GaN功率半导体供应商和铜片金属化·GaN预封装的生产能力。这包括带有单个或多个GaN器件的预封装以及带有集成驱动器的半桥布置。·通过将经过测试的GaN预封装嵌入到全转换器中，然后进行传统组装，从而制造电力系统电路板。·建立数字工具链，用于为各种电力电子应用定制预封装和嵌入式电源子系统。·建立供应链，以表征器件、预封装和嵌入式子系统的电气、热和可靠性性能。所有这些嵌入式制造能力都可以简单地调整以便于测试，采用基于P3EP供应链的嵌入式WBG设备的电力系统将在转换器的重量、体积、效率和功率密度方面带来改进。这些方面对于汽车和更电动的航空航天应用尤其重要，这些应用是该技术的早期采用者。虽然英国拥有世界领先的电子制造能力，但目前还没有组装嵌入式电力电子产品的生产线。P3EP项目将结束这一限制，使英国PEMD行业能够为广泛的市场提供更小、更轻、更可靠的电力电子解决方案。

The project "Pre-packaged Power Devices for PCB Embedded Power Electronics" (P3EP) develops a UK supply chain for PCB-embedded power systems with Gallium Nitride (GaN) devices. The P3EP supply chain will allow PEMD manufacturers to build converters with the highest power densities and it will allow UK power semiconductor companies to enter these markets.Wide bandgap power devices such as GaN offer extremely high switching speeds and the possibility to significantly reduce system size. But this can only be exploited with new packaging and module construction methods which increase thermal transfer and reduced parasitic effects. The emerging technology of embedding power devices into the PCB has proven to be the most advanced way to achieve this goal. P3EP develops the complete supply chain in the UK.The P3EP manufacturing chain is based on GaN pre-packages. Pre-packages have major advantages over bare dies because they allow production testing, characterisation, and reliability qualification. This improves yield, cost, and time-to-market for the PEMD system. Further, pre-packages use materials with optimised compatibility with the chip and enable much-simplified embedding into the system-PCB.The P3EP supply chain comprises:• GaN power semiconductor supplier and Cu chip metallisation• Production capability for GaN pre-packages. This includes pre-packages with single or multiple GaN devices as well as half-bridge arrangements with integrated driver.• Manufacturing of power-system PCBs by embedding tested GaN pre-packages followed by traditional assembly into a full converter.• Set up the digital toolchain for the customisation of pre-packages and embedded power sub-systems for a large variety of power electronic applications.• Set up the supply chain for characterisation of electrical, thermal and reliability performance of device, pre-package, and embedded subsystems.All these embedded manufacturing capabilities can be simply adapted to facilitate testing, characterisation and embedding of other power semiconductor technologies such as Silicon or Silicon Carbide.Power systems with embedded WBG devices based on the P3EP supply chain will deliver improvements in the weight, volume, efficiency, and power density of the converter. These aspects are particularly important for automotive and more-electric aerospace applications, the early adopters of the technology. While there are world-leading electronics manufacturing capabilities in the UK, there is currently no manufacturing line for assembling embedded power electronics. Project P3EP will close this cap enabling the UK PEMD industry to deliver smaller, lighter, more reliable solutions in power electronics for a wide range of markets.