Low Cost and SWAP High Density Packaging for Future RADAR

该项目将为包括高密度系统封装（SiP）设计在内的化合物半导体器件开发专业的塑料封装能力。这种生产和原型设施将是独一无二的，专注于低重量、低成本的高密度封装，适用于最具挑战性的材料和操作环境的高功率器件。需要解决的一些关键领域包括实现最佳热/机械性能的模具附加和定制设计，以减轻诸如线粘接提升、模具溢出和封装分层等问题。减小尺寸、重量、功率和成本（SWAP-C），同时增加复杂性是未来传感器和探测器系统的关键推动因素，该项目最初将针对电子扫描机载雷达系统的发射接收模块，但该技术同样适用于国防和商业应用的其他探测器、传感器和通信系统。Filtronic是位于英格兰北部的从射频到毫米波的组件和子系统的设计师和制造商。我们服务的市场包括电信、关键通信、航空航天/国防和空间。我们是英国和欧洲国防合同的首选供应商。最先进的设施将与我们现有的制造设施相辅相成，并将为英国航空航天和国防工业提供显著的竞争优势，为需要高水平安全的产品提供主权能力。

This project will develop a specialist, plastic encapsulation capability for compound semiconductor devices including high density System in Package (SiP) designs. This production and prototyping facility would be unique, focused on low-weight, low-cost high-density packaging for high power devices for the most challenging materials and operational environments. Some key areas to address include die attach for optimal thermal/mechanical performance and custom design to mitigate issues such as wire bond lift, mould bleed and package delamination.Reducing Size Weight Power and Cost (SWAP-C), while simultaneously increasing complexity is a key enabler for future sensor and detector systems, this project will initially target transmit receive modules for electronically scanned airborne radar systems, but the technology is equally applicable to other detector, sensor and communication systems for defence and commercial applications.Filtronic are designers and manufacturers of components and sub-systems from RF to mmWave based in the North of England. We serve markets including Telecommunications, Critical Communications, Aerospace/Defence and Space. We are a preferred supplier to UK and European defence primes. The state-of-the-art facility would be complementary to our existing manufacturing facilities and would give the UK aerospace and defence industry a significant competitive advantage with a sovereign capability for products that require a high level of security.