Intelligent and Efficient Thermal Managed Power Module for Low Carbon Vehicles

混合动力汽车(HEV/EV)具有环保、对化石燃料的依赖少、长期运营成本低等优点，受到各国政府和汽车制造商的高度关注。在混合动力汽车/电动汽车动力系统中，功率控制是必不可少的，而功率IGBT模块是混合动力汽车动力总成系统的核心部件。模块对电气和热性能、效率和可靠性的要求都很严格。在本项目中，开发了一款集智能驱动器、高效热管理理念和先进封装技术于一体的混合动力汽车/电动汽车功率IGBT模块。通过将DyneX半导体公司在功率半导体领域的领先专业知识与诺丁汉大学在强化传热和冷却方面的尖端研究相结合。一种新型的功率IGBT模块将被开发出来，它具有扁平的热管基板和智能栅极驱动器，采用了先进的键合和连接技术，如铜线、银烧结和超声波焊接。与针翅片结构相比，该模块的换热效率提高了20%，并通过消除昂贵、不可靠的部件和提高效率简化了冷却系统。

The advantages brought by Hybrid and Electric Vehicles (HEV/EV) such as being environmentally friendly, less dependent on fossil fuels, cost effective in long term operation etc, HEV/EV has highly focused governments and car manufacturers. Power control is essential in HEV/EV powertrain systems of which the core part is the power IGBT modules. The requirements of modules are strict in electrical and thermal performance, efficiency and reliability. In this project, a power IGBT module incorporating intelligent driver, efficient thermal management concept and advanced packaging technologies for HEV/EV is developed. By combining Dynex Semiconductor's leading expertise in power semiconductors and the University of Nottingham's cutting edge research in enhanced heat transfer and cooling. A new power IGBT module with a flat heat pipe baseplate and intelligent gate driver using advanced bonding and joining technologies such as copper wires, silver sintering and ultrasonic welding will be developed. The module increases heat transfer efficiency by 20% compared with pin fin structures and simplifies cooling system by removing costly, unreliable parts and enhancing efficiency.