THEIA - Technically high element aligmenent

THEIA项目将研究如何使用III-V族化合物半导体器件将红外焦平面阵列组装到传统的低成本硅上。该项目的新颖之处在于，它旨在使用传统的商业规格工艺和模具贴装设备，而不是定制高公差机械。通常，它们用于高价值的应用，如空间、军事和安全。这些高分辨率成像系统通常使用堆叠在传统硅读出芯片上然后放置在混合堆叠中的适当封装中的III-V组传感器管芯的组合

The Theia project will investigate the assembly of Infrared Focal Plane arrays using group III-V compound semiconductor devices onto conventional lower cost silicon. The project is novel in that it aims to use conventional commercial specification process and die placement equipment rather than bespoke high tolerance machinery. Typically, these are used in high value applications such as space, military and security. These high resolution imaging systems typically use a combination of Group III-V sensor die stacked onto conventional silicon read-out chip and then placed into a suitable package in a hybrid stack