High performance wireless/photonic interfaces for 60 GHz radio over fibre applications

在本项目中，实现多千兆无线传输和接收所需的半导体器件技术与半导体光器件和光纤网络的能力相结合，以提高点对点通信链路所需的速度、安全性和成本。该方案利用了毫米波频谱中这些频率的最新发展标准和技术，特别是在频率的v波段。这种无线光技术的高数据速率（bbb7gbps）是目前无线通信行业中使用的数据速率的几倍。该技术在抗干扰、减小组件和天线尺寸方面也有额外的好处。本项目无线光接口器件采用化合物半导体（III-V）材料（InP）同一平台。对于接口的无线部分，有源元件以谐振隧穿二极管RTD（振荡器）的形式实现。对于接口的光学部分，有源元件采用高速分布式反馈（DFB）激光器实现。这两个集成组件构成了单个封装无线光收发器解决方案。

In this project, the semiconductor device technology required to achieve multi-gigabit wireless transmission and reception is integrated with the capabilities of semiconductor optical device and fiber networks in order to improve the speed, security, and cost required for point to point communication links. The scheme exploits the recent development of standards and techniques around those frequencies in the millimeter wave spectrum, specifically in the V-band of frequencies. The high data rate possible with this wireless-opto technology (>7Gbps) is several times larger than the data rates currently used in the wireless communications industry. The technology has also additional benefits in terms of immunity from interference, and reduced size of components and antennas. The wireless-opto interface devices in this project share the same platform of compound semiconductor (III-V) material (InP). For the wireless part of the interface, the active component is implemented in the form of a resonant tunnelling diode RTD (oscillator). For the optical part of the interface, the active component is implemented as a high speed distributed feedback (DFB) laser. Both integrated components form the single package wireless-opto transceiver solution.