Low-cost embedded heterogeneous-component manufacturing process for integrated power electronics

我们将通过实现宽带隙开关在100 s W至100 s kW功率级应用中的真正潜力，展示电子功率转换系统制造的范式转变。电力电子转换器采用表面贴装技术进行组装，用于低水平电子器件和通孔和较大能量存储和滤波器组件的手动/半自动组装。组装过程缓慢，较大组件的几何形状范围有限，限制了对受限应用几何形状和可实现功率密度的适应。我们将通过将功率元件、传感器和控制电子设备嵌入PCB层压板中来创建3D组件，从而实现功率密集型完整解决方案，并使用单一制造工艺流程进行复杂的3D内部布线。许多单独的转换器可以在一张卡片上制造，因此该工艺适用于大批量和小批量生产，并且可以重新配置而无需重新加工，因此一条生产线可以容纳许多不同的产品。因此，可以预期，与目前最先进的技术相比，成本将大幅降低。

We will demonstrate a paradigm shift in the manufacture of electronic power conversion systems by achieving the true potential of wide band-gap switches in applications at power levels from 100s W to 100s kW. Power electronic converters are assembled using a mixture of surface mount technology for low-level electronics & hand/semi-automated assembly of through-hole & larger energy storage & filter components. The assembly processes are slow & the limited range of geometric forms of larger components limits adaption to restricted application geometries & achievable power density. We will create 3D assemblies of power components, sensors & control electronics by embedding these in a PCB laminate allowing power-dense, complete solutions, with complex, 3D internal routing using a single manufacturing process flow. Many individual converters can be made on a single card so the process is suitable for both large & small-volume production & can be reconfigured without re-tooling, so many different products can be accommodated on one production line. Huge reductions in cost over the current state-of-the-art can thus be expected.