(LAND) Laser drilling guideplAtes for semicoNDuctor wafer test

兰德公司将为下一代设备开发陶瓷组件的超高精度激光打孔。高孔数陶瓷板需要每个板上有超过60,000个激光钻孔，每个最终设备需要几个板。牛津激光(OL)自2001年以来一直是世界领先的陶瓷钻探技术供应商，在主要的工业供应链中发挥着至关重要的作用。每年设备都变得越来越小，技术挑战是在越来越狭窄的节距上钻出越来越小的孔。该项目将开发新的硬件原型和先进的激光打孔配方，以进步当前的技术水平，并展示缩小孔尺寸、提高纵横比和更快的生产率。该项目将把TRL的开发水平从3级提升到6级。牛津激光公司将在该领域现有专业知识的基础上，部署我们的研发团队和专用硬件，以29年的激光打孔经验为基础。我们预计这个项目将使牛津激光公司继续在关键的、快速增长的出口市场占据主导地位，并增加市场份额，因为机械钻探作为一种竞争解决方案正在迅速萎缩。关键词：陶瓷激光钻探、半导体晶片测试、普罗贝卡

LAND will develop ultra-high precision laser drilling in ceramic components for next generation devices. High hole count ceramic plates are required with more than 60,000 laser drilled holes per plate with several plates needed per final device. Oxford Lasers (OL) has been a world-leading supplier of the ceramic drilling technology since 2001 and plays a critically important role in major industrial supply chains.Each year devices get smaller and the technical challenge is to drill ever smaller holes on ever tighter pitches. The project will develop new hardware prototypes and advanced laser drilling recipes to progress current state of art and demonstrate reduced hole size, increased aspect ratio and faster production rates. The project will lift developments from TRL level 3 to 6\.Oxford Lasers will build on existing expertise in this field and deploy our R&D team and dedicated hardware to the project building on 29 years laser drilling experience. We expect this project to enable Oxford Lasers to continue its dominant presence in critical, rapidly growing export markets and increase market share as mechanical drilling is fast dwindling as a competing solution.Keywords: ceramic laser drilling, semiconductor wafer test, Probecard