In situ observations of bonding reactions for high temperature electronics

宽带隙半导体（如碳化硅和氮化镓）的出现为新一代电力电子器件铺平了道路，这些器件可以在相对较高的温度下工作（温度范围可以超过200 ℃）。集成此类电子设备的产品将对汽车、航空航天、能源和国防领域的未来发展具有决定性意义。为了使电力电子设备能够在高温下工作，焊料产品应能够承受这些温度，并需要合适的连接方法来连接它们。高质量的高温键合是一种先驱，可在高温下为电子设备提供稳定和重新标记的操作，并具有必要的电气，热和机械互连。为了成功开发和建立基于准环境键合技术平台的新型环保焊接材料及其连接方法，对相关键合机制的科学理解至关重要。尖端的快速同步辐射X射线成像工具将被用于本项目中，以调查这些焊料键合过程和焊料的界面评价。此外，高分辨率电子显微镜将被用于提取与一系列新兴无铅焊料的键合界面相关的进一步补充科学信息，该项目有望提供新的准环境键合工艺中无铅焊料键合形成的物理和冶金机制的新科学细节。特别是这些细节将有助于增强和进一步开发下一代超高效焊接材料，这些材料可以与最先进的焊接技术一起使用。

The emergence of wide-bandgap semiconductors such as silicon carbide and gallium nitride has paved the way for a new generation of power electronic devices that can operate at relatively high temperatures (ranges which can run above 200C). Products incorporating such electronic devices will be extremely decisive for future advancements in the automotive, aerospace, energy and defense sectors. To enable high temperature operation of power electronics devices, solders products should withstand in those temperatures and suitable boding method to join them are required. Quality high temperature bonding is a kind of precursor to provide robust and relabel operation of the electronic devices at high temperatures with necessary electrical, thermal and mechanical interconnections. To successfully develop and establish new environmentally friendly solder materials and their joining methods based on quasi-ambient bonding technology platforms, a strong scientific understanding of relevant bonding mechanisms are essential. Cutting edge fast synchrotron X-ray imaging tools will be used in this project to investigate those solder bonding processes and interface evaluation of the solders. In addition, high resolution electron microscopy will be employed to extract further complimentary scientific information of related to the bonding interfaces of a new range of emerging Pb-free solders.The project is expected to deliver novel scientific details of the physical and metallurgical mechanism of Pb-free solder bond formations occur in new quasi-ambient bonding processes. Particularly those details will help to enhance and further develop next generation ultra-effective solder materials, which can be used with the state of the art soldering techniques.